5SGXMA5N2F40C3N

The 5SGXMA5N2F40C3N is a Stratix® V GX series Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package. It delivers a large programmable fabric and high I/O density for demanding digital designs where significant logic capacity and on-chip memory are required.

Designed for commercial-temperature applications, this surface-mount FPGA combines a high logic element count, substantial embedded RAM, and a broad operating voltage window for core supply to support complex, tightly integrated system designs.

Key Features

• Programmable Fabric — 490,000 logic elements (cells) for implementing large-scale digital logic, state machines, and custom compute engines.
• Embedded Memory — Approximately 46.08 Mbits of on-chip RAM to support buffering, packet processing, and local data storage without external memory.
• I/O Density — 600 user I/O pins, enabling heavy interfacing requirements and dense system integration.
• Power — Core voltage supply range specified at 820 mV to 880 mV to match system power-rail requirements for the device core.
• Package & Mounting — 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40); surface-mount mounting type for PCB assembly.
• Temperature & Grade — Commercial grade with operating temperature from 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High-density I/O systems — Use the 600 I/O pins to aggregate and route large numbers of signals in complex interface hubs and protocol converters.
• Compute and acceleration — Leverage 490,000 logic elements and substantial embedded RAM for custom accelerators, DSP blocks, and parallel processing engines.
• Network and packet processing — Large on-chip RAM (≈46.08 Mbits) and high logic capacity to implement packet buffering, classification, and flow management.
• System integration and prototyping — Surface-mount 1517-BBGA package supports compact board designs that require a high-density programmable device for integration and development.

Unique Advantages

• High programmable capacity: 490,000 logic elements provide the headroom to implement complex, multi-function designs on a single device, reducing part count.
• Substantial on-chip memory: Approximately 46.08 Mbits of embedded RAM minimizes dependence on external memory for many buffering and temporary-storage tasks.
• Extensive I/O connectivity: 600 I/O pins enable dense front-end interfacing and flexible pin assignment for diverse system requirements.
• Commercial-temperature rating: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• Surface-mount FCBGA package: 1517-BBGA (1517-FBGA 40×40) supports compact PCB layouts and automated assembly processes.
• Regulatory compliance: RoHS compliance supports modern manufacturing and sourcing requirements.

Why Choose 5SGXMA5N2F40C3N?

The 5SGXMA5N2F40C3N positions itself as a high-capacity, commercially rated FPGA option within the Stratix® V GX family, balancing large logic resources, sizable embedded RAM, and extensive I/O in a compact surface-mount FCBGA package. It is suited to engineering teams building complex digital systems that require significant on-chip resources and dense connectivity without moving to specialized temperature grades.

For designs that demand scalability and integration—such as advanced prototyping, compute acceleration, and high-density I/O aggregation—this FPGA offers a consolidated platform with clear electrical and mechanical specifications to streamline PCB and system-level design decisions.

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