5SGXMA5N2F40I2LN

The 5SGXMA5N2F40I2LN is a Stratix® V GX field programmable gate array (FPGA) IC from Intel (Altera). It delivers very high logic capacity and embedded memory in a 1517-BBGA FCBGA package designed for surface-mount assembly.

Targeted at industrial applications, this device combines approximately 490,000 logic elements, roughly 46.08 Mbits of on-chip RAM, and 600 I/Os to support complex, high-density digital designs that require significant I/O and embedded memory resources.

Key Features

• Logic Capacity  Approximately 490,000 logic elements to implement large, high-complexity digital designs.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for buffering, lookup tables, and data storage inside the FPGA fabric.
• I/O Density  600 general-purpose I/Os to support wide parallel interfaces, high-pin-count peripherals, and extensive board-level connectivity.
• Package & Mounting  1517-BBGA (supplier package: 1517-FBGA 40×40) in an FCBGA format, designed for surface-mount PCB assembly.
• Power Supply  Specified core voltage range from 820 mV to 880 mV to match modern low-voltage FPGA core rails.
• Industrial Temperature Grade  Rated for industrial operation with an operating temperature range of −40 °C to 100 °C.
• Standards Compliance  RoHS compliant.

Typical Applications

• Industrial control and automation  High logic density and wide I/O counts enable complex control algorithms, distributed I/O aggregation, and real-time processing in industrial equipment.
• Communications infrastructure  Large embedded memory and abundant I/Os support packet buffering, framing, and interface bridging for telecom and network equipment.
• High-performance embedded systems  Use the device’s logic and memory resources for compute- and data-intensive embedded designs that require configurable hardware acceleration.
• Prototyping and system integration  Ideal for integrating multiple digital subsystems and validating high-density designs prior to production.

Unique Advantages

• High logic integration: Approximately 490,000 logic elements reduce the need for multiple devices, simplifying board layout and lowering BOM complexity.
• Substantial on-chip memory: ~46.08 Mbits of embedded RAM provides sizable local storage for buffering and lookup operations, reducing external memory dependency.
• Extensive I/O availability: 600 I/Os offer flexibility for parallel interfaces, multi-channel connectivity, and broad peripheral support.
• Industrial-grade operation: Rated for −40 °C to 100 °C, making the device suitable for demanding environments within the industrial temperature range.
• Compact FCBGA package: 1517-FBGA (40×40) package balances high pin count with a compact footprint for space-constrained designs.
• Regulatory compliance: RoHS compliance simplifies environmental qualification for many commercial and industrial production programs.

Why Choose 5SGXMA5N2F40I2LN?

The 5SGXMA5N2F40I2LN delivers a combination of high logic density, significant embedded memory, and large I/O capability in an industrial-temperature, surface-mount FCBGA package. It is positioned for engineers and designers building complex digital systems that require integrated resources to minimize external components and support robust, long-term deployments.

For teams focused on scaling functionality within constrained board area—while maintaining industrial operating range and compliance—the device provides a clear platform for integrating compute, memory, and I/O in a single programmable device backed by the Stratix V family documentation.

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