5SGXMA5N2F40I3G

The 5SGXMA5N2F40I3G is a Stratix V GX FPGA in a 1517-BBGA FCBGA package, offered in an industrial temperature grade. This device integrates high-density programmable logic, substantial embedded RAM, and a large number of I/O, making it suitable for advanced, performance-oriented designs that require significant on-chip resources and rugged operating range.

Key Features

• Core Architecture Stratix V GX FPGA architecture in an industrial-grade offering, designed for applications requiring high integration of logic and I/O.
• Logic Capacity Approximately 490,000 logic elements for implementing complex digital functions and large-scale logic designs.
• Embedded Memory Approximately 46.08 Mbits of embedded memory (total RAM bits: 46,080,000) to support data buffering, frame storage, and on-chip algorithm state.
• I/O Density 600 I/O pins to accommodate wide external interfaces, parallel buses, and multiple high-pin-count peripherals.
• Power Core voltage supply range 820 mV to 880 mV, enabling compatibility with specified low-voltage core power domains.
• Package & Mounting 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount mounting type for PCB assembly.
• Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding thermal environments.
• Compliance RoHS compliant, meeting environmental requirements for lead-free assembly.

Typical Applications

• High-density logic systems — Implement complex state machines, datapath pipelines, and custom processing engines using the device’s large logic-element count.
• On-chip buffering and memory-intensive processing — Use the approximately 46.08 Mbits of embedded memory for frame buffers, packet queues, or algorithm state storage.
• Multi-interface and I/O-rich designs — Leverage 600 I/O pins for wide parallel interfaces, multi-channel data acquisition, or extensive peripheral connectivity.
• Industrial systems — Designed to operate across −40 °C to 100 °C, suitable for industrial control, automation, and instrumentation applications requiring extended temperature ranges.

Unique Advantages

• High logic density: The device’s ~490,000 logic elements enable consolidation of multiple functions onto a single FPGA to reduce system complexity and PCB count.
• Substantial on-chip memory: Approximately 46.08 Mbits of RAM supports large buffers and stateful processing without external memory dependency.
• Extensive I/O availability: 600 I/O pins provide flexibility for connecting high-pin-count peripherals, wide buses, or multiple simultaneous interfaces.
• Industrial temperature capability: Rated from −40 °C to 100 °C, making the device suitable for environments with wide thermal variation.
• Low-voltage core operation: Core supply range of 820 mV to 880 mV accommodates designs targeting low-voltage power domains.
• RoHS compliant packaging: Meets environmental assembly requirements for lead-free production.

Why Choose 5SGXMA5N2F40I3G?

The 5SGXMA5N2F40I3G combines high logic capacity, significant embedded memory, and a large I/O count in an industrial-grade Stratix V GX package. It is well suited for engineers and teams building complex digital systems that require on-chip resources, robust thermal performance, and flexible I/O connectivity. The device’s combination of integration and specification transparency makes it a practical choice for scalable, long-life designs in industrial and performance-driven applications.

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