5SGXMA5N2F40I3N

The 5SGXMA5N2F40I3N is a Stratix® V GX FPGA designed for applications that require large amounts of programmable logic, on-chip memory, and high I/O capacity. It combines a high logic element count with substantial embedded RAM and a wide industrial operating temperature range to support demanding embedded and industrial system designs.

Electrical and switching characteristics for the Stratix V family, including operating conditions and power parameters, are documented in the device datasheet supplied with the product.

Key Features

• Logic Capacity — 490000 logic elements to implement large and complex programmable designs.
• Embedded Memory — Approximately 46.08 Mbits of on-chip RAM for data buffering, state storage, and memory-intensive logic functions.
• I/O Resources — 600 I/Os to support dense external connectivity and parallel interfaces.
• Core Voltage — Core supply range specified at 820 mV to 880 mV for the device core.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Package — 1517-BBGA (FCBGA) supplier package, listed as 1517-FBGA (40 × 40) for board-level integration.
• Regulatory — RoHS compliant.

Typical Applications

• Network and Communications — Use the device where large programmable logic and numerous I/Os are required for packet processing, protocol bridging, or custom interface implementations.
• Signal Processing — Deploy for data-path acceleration, real-time signal conditioning, and buffering leveraging the large on-chip RAM and high logic density.
• Industrial Control Systems — Suitable for industrial automation and control applications that require robust operation across −40 °C to 100 °C and extensive I/O connectivity.
• High-density Embedded Systems — Fit for complex embedded designs that demand high logic count and significant memory resources on a single programmable device.

Unique Advantages

• High Logic Density: 490000 logic elements enable consolidation of large FPGA designs into a single device, reducing system complexity.
• Substantial On-chip Memory: Approximately 46.08 Mbits of embedded RAM supports buffering, FIFOs, and memory-intensive algorithms without external RAM.
• Extensive I/O Capability: 600 I/Os provide flexibility for wide parallel buses, multiple interfaces, and high pin-count peripherals.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in harsh or thermally varied environments.
• Compact FCBGA Packaging: 1517-BBGA (1517-FBGA, 40 × 40) package supports high-density board layouts while providing the pin count required by complex systems.
• RoHS Compliant: Conforms to lead-free manufacturing requirements for regulatory and environmental compatibility.

Why Choose 5SGXMA5N2F40I3N?

The 5SGXMA5N2F40I3N positions itself for designs that demand a balance of large programmable logic resources, significant embedded memory, and substantial I/O capacity, all within an industrial temperature-rated FPGA. Its specified core voltage range and FCBGA package make it suitable for tightly integrated system boards where thermal and power constraints are important considerations.

This device is appropriate for engineering teams building complex embedded systems, industrial controls, and communication equipment that require a single, high-capacity FPGA to reduce board-level complexity and support long-term product robustness.

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