5SGXMA5N2F45C1G

The 5SGXMA5N2F45C1G is a Stratix® V GX field programmable gate array (FPGA) supplied in a 1932-BBGA FCBGA surface-mount package. It combines high logic capacity with substantial on-chip memory and a large I/O count for dense, I/O-rich designs in commercial-temperature applications.

With 490,000 logic elements, approximately 46 Mbits of embedded memory and 840 I/Os, this device is targeted at applications that require high integration density, broad external connectivity and commercial-grade operating conditions (0 °C to 85 °C).

Key Features

• Core Logic  490,000 logic elements (logic cells) for implementing large, complex digital designs.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, scratchpad storage and memory-intensive logic functions.
• I/O Integration  840 general-purpose I/Os to support wide external interfacing and high pin-count system architectures.
• Power Supply  Core voltage supply range of 870 mV to 930 mV to match system power-domain requirements.
• Package & Mounting  1932-BBGA (FCBGA) surface-mount package; supplier package specified as 1932-FBGA, FC (45×45).
• Operating Temperature  Commercial-grade rating with an operating range of 0 °C to 85 °C.
• Compliance  RoHS-compliant manufacturing.
• Stratix V GX Family  Part of the Stratix V GX family; series documentation indicates availability of commercial speed grades for GX devices.

Typical Applications

• High-density digital processing  Implement large-scale logic functions and custom datapaths using the device's 490,000 logic elements.
• Memory‑centric designs  Use the approximately 46 Mbits of embedded RAM for buffering, packet processing or other on-chip storage needs.
• High I/O systems  Leverage 840 I/Os to connect multiple peripherals, expanders and high-pin-count interfaces in a single FPGA.
• Commercial embedded platforms  Deploy in systems that operate within the commercial temperature range (0 °C to 85 °C).

Unique Advantages

• High integration density: 490,000 logic elements enable consolidation of substantial digital logic into a single device, reducing external component count.
• Large on-chip memory: Approximately 46 Mbits of embedded RAM provides significant local storage for data buffering and state retention without adding external memory.
• Extensive I/O: 840 I/Os support complex system interconnect and multiple parallel interfaces directly from the FPGA.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to align with commercial embedded system requirements.
• Compact, surface-mount packaging: 1932-BBGA FCBGA (45×45) package balances high pin count with a standard surface-mount footprint for board-level integration.
• RoHS compliance: Manufactured to meet RoHS environmental regulations.

Why Choose 5SGXMA5N2F45C1G?

The 5SGXMA5N2F45C1G offers a high-density Stratix V GX FPGA solution that pairs a large logic resource pool with substantial embedded memory and an extensive I/O complement in a single surface-mount package. Its commercial-grade operating range and RoHS compliance make it suitable for high-capacity, I/O-intensive embedded designs that require on-chip memory and logic consolidation.

This device is positioned for engineers and procurement teams designing systems that need significant programmable logic, large on-chip RAM capacity and broad external interfacing without moving to an industrial-temperature grade. As a member of the Stratix V GX family, it aligns with the series-level device characteristics documented in the Stratix V device literature.

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