5SGXMA5N2F40I3LN

The 5SGXMA5N2F40I3LN is a Stratix V GX series FPGA from Intel, delivered in a 1517-FBGA (40×40) surface-mount package. It combines high logic density, substantial embedded RAM, and a large I/O count to address demanding programmable-logic designs.

Designed for industrial-temperature operation, this device targets applications that require significant on-chip resources, robust I/O capacity, and support for Stratix V GX family transceiver speed grades. Key value comes from its large logic fabric, abundant embedded memory, and industrial temperature qualification.

Key Features

• Core capacity — 490,000 logic elements (cells) and 185,000 LABs/CLBs provide ample programmable logic for complex designs.
• Embedded memory — approximately 46 Mbits of on-chip RAM (46,080,000 bits) for data buffering, FIFOs, and distributed memory functions.
• I/O density — 600 user I/O pins to support wide parallel interfaces, multiple high-speed lanes, and rich system connectivity.
• Transceiver family capability — Stratix V GX family transceiver speed grades are documented up to 14.1 Gbps (series-level specification), enabling high-speed serial link support where implemented.
• Power supply — core voltage operating range specified at 820 mV to 880 mV for accurate power-domain planning.
• Industrial temperature grade — rated for operation from –40°C to 100°C, suitable for temperature-demanding environments.
• Package & mounting — 1517-BBGA / 1517-FBGA (40×40) FCBGA package; surface-mount mounting type for dense PCB implementations.
• Environmental compliance — RoHS compliant.

Typical Applications

• High-density programmable logic — Large-scale FPGA implementations that require hundreds of thousands of logic elements and substantial on-chip RAM for algorithm acceleration and custom datapaths.
• High-speed serial systems — Designs leveraging Stratix V GX transceiver speed grades for multi-gigabit serial links and backplane or fiber connectivity (series-level device capability).
• Industrial control and automation — Systems operating across –40°C to 100°C that need flexible logic, large I/O counts, and reliable operation in industrial environments.
• Data buffering and packet processing — Applications that benefit from approximately 46 Mbits of embedded RAM for packet queues, buffering, and intermediate storage.

Unique Advantages

• Significant programmable capacity: 490,000 logic elements enable complex, multi-function designs without immediate need for multiple devices.
• Large embedded RAM: Approximately 46 Mbits of on-chip memory reduces dependence on external memory for many buffering and temporary storage tasks.
• High I/O count: 600 I/O pins simplify integration with wide parallel interfaces, multiple peripherals, and dense connector architectures.
• Industrial temperature rating: Specified –40°C to 100°C operation supports deployment in temperature-challenging environments.
• Surface-mount FBGA package: 1517-FBGA (40×40) package supports compact PCB layouts while providing high pin-count connectivity.
• Series-level transceiver capability: Stratix V GX family documentation includes transceiver speed grades up to 14.1 Gbps, enabling high-speed serial options where required.

Why Choose 5SGXMA5N2F40I3LN?

This Stratix V GX FPGA part delivers a combination of high logic density, sizable embedded memory, and extensive I/O in an industrial-temperature, surface-mount FBGA package. It is well suited for engineers designing large, performance-oriented programmable systems that require significant on-chip resources and robust temperature performance.

For teams building scalable, compute- and I/O-intensive hardware, the 5SGXMA5N2F40I3LN provides a platform that balances capacity and integration, backed by the Stratix V series device characteristics documented for electrical and transceiver performance.

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