5SGXMA7N1F40C1N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 438 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXMA7N1F40C1N – Stratix V GX FPGA, 622,000 logic elements, ~51.2 Mbits RAM, 600 I/Os
The 5SGXMA7N1F40C1N is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It delivers high logic density with 622,000 logic elements and approximately 51.2 Mbits of on-chip RAM, alongside up to 600 user I/Os to support I/O‑intensive designs.
Packaged for surface-mount assembly and rated for commercial operation (0°C to 85°C) with a core supply range of 870 mV to 930 mV, this device targets designs that require dense programmable logic, substantial embedded memory, and broad I/O capacity.
Key Features
- Core & logic capacity 622,000 logic elements provide a high-capacity fabric for complex digital functions and large-scale logic integration.
- Embedded memory Approximately 51.2 Mbits of on-chip RAM for buffers, FIFOs, and implemented memory structures.
- I/O density Up to 600 user I/Os to support parallel interfaces, board-level peripherals, and extensive connectivity requirements.
- Package & mounting 1517-BBGA (FCBGA) / supplier package 1517-FBGA (40×40) in a surface-mount form factor for compact board integration.
- Power supply Core voltage supply specified between 870 mV and 930 mV to match system power architecture requirements.
- Temperature & grade Commercial grade device rated for operation from 0°C to 85°C.
- Standards & compliance RoHS compliant for lead-free manufacturing and environmental compliance.
Typical Applications
- High-density digital processing Implement large custom logic blocks and complex state machines using the device’s 622,000 logic elements and embedded RAM.
- Memory buffering and data staging Use the ~51.2 Mbits of on-chip RAM for FIFOs, packet buffering, and temporary data storage inside high-throughput datapaths.
- I/O-intensive system integration Leverage up to 600 I/Os for board-level interconnect, parallel buses, or multiple peripheral interfaces.
- Compact surface-mount designs The 1517-FBGA (40×40) package enables dense PCB layouts where board space and component count are constrained.
Unique Advantages
- High programmable logic density: 622,000 logic elements allow consolidation of complex functions into a single device, reducing board-level component count.
- Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM supports on-device buffering and reduces dependence on external memory.
- Large I/O complement: Up to 600 I/Os simplifies system-level partitioning and supports multiple parallel interfaces without external multiplexing.
- Commercial temperature rating: Specified 0°C to 85°C operation fits a wide range of commercial and enterprise-class applications.
- Surface-mount FCBGA package: 1517-FBGA (40×40) provides a compact form factor for space-constrained, high-density PCBs.
- RoHS compliant: Enables compliance with lead-free manufacturing processes and regulatory requirements.
Why Choose 5SGXMA7N1F40C1N?
The 5SGXMA7N1F40C1N pairs large-scale programmable logic with substantial embedded memory and a high I/O count in a compact FCBGA package. It is positioned for system designs that require consolidating complex digital functions and significant data buffering within a single FPGA while maintaining a surface-mount footprint and commercial temperature operation.
Intel Stratix V GX architecture and the specifications provided make this device suitable for engineers seeking a high-density, memory-rich FPGA platform that integrates many I/Os without expanding PCB complexity. Its RoHS compliance and defined core voltage range simplify system-level design and manufacturing planning.
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