5SGXMA7N1F40C1N

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 51200000 622000 1517-BBGA, FCBGA

Quantity 438 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7N1F40C1N – Stratix V GX FPGA, 622,000 logic elements, ~51.2 Mbits RAM, 600 I/Os

The 5SGXMA7N1F40C1N is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It delivers high logic density with 622,000 logic elements and approximately 51.2 Mbits of on-chip RAM, alongside up to 600 user I/Os to support I/O‑intensive designs.

Packaged for surface-mount assembly and rated for commercial operation (0°C to 85°C) with a core supply range of 870 mV to 930 mV, this device targets designs that require dense programmable logic, substantial embedded memory, and broad I/O capacity.

Key Features

  • Core & logic capacity  622,000 logic elements provide a high-capacity fabric for complex digital functions and large-scale logic integration.
  • Embedded memory  Approximately 51.2 Mbits of on-chip RAM for buffers, FIFOs, and implemented memory structures.
  • I/O density  Up to 600 user I/Os to support parallel interfaces, board-level peripherals, and extensive connectivity requirements.
  • Package & mounting  1517-BBGA (FCBGA) / supplier package 1517-FBGA (40×40) in a surface-mount form factor for compact board integration.
  • Power supply  Core voltage supply specified between 870 mV and 930 mV to match system power architecture requirements.
  • Temperature & grade  Commercial grade device rated for operation from 0°C to 85°C.
  • Standards & compliance  RoHS compliant for lead-free manufacturing and environmental compliance.

Typical Applications

  • High-density digital processing  Implement large custom logic blocks and complex state machines using the device’s 622,000 logic elements and embedded RAM.
  • Memory buffering and data staging  Use the ~51.2 Mbits of on-chip RAM for FIFOs, packet buffering, and temporary data storage inside high-throughput datapaths.
  • I/O-intensive system integration  Leverage up to 600 I/Os for board-level interconnect, parallel buses, or multiple peripheral interfaces.
  • Compact surface-mount designs  The 1517-FBGA (40×40) package enables dense PCB layouts where board space and component count are constrained.

Unique Advantages

  • High programmable logic density: 622,000 logic elements allow consolidation of complex functions into a single device, reducing board-level component count.
  • Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM supports on-device buffering and reduces dependence on external memory.
  • Large I/O complement: Up to 600 I/Os simplifies system-level partitioning and supports multiple parallel interfaces without external multiplexing.
  • Commercial temperature rating: Specified 0°C to 85°C operation fits a wide range of commercial and enterprise-class applications.
  • Surface-mount FCBGA package: 1517-FBGA (40×40) provides a compact form factor for space-constrained, high-density PCBs.
  • RoHS compliant: Enables compliance with lead-free manufacturing processes and regulatory requirements.

Why Choose 5SGXMA7N1F40C1N?

The 5SGXMA7N1F40C1N pairs large-scale programmable logic with substantial embedded memory and a high I/O count in a compact FCBGA package. It is positioned for system designs that require consolidating complex digital functions and significant data buffering within a single FPGA while maintaining a surface-mount footprint and commercial temperature operation.

Intel Stratix V GX architecture and the specifications provided make this device suitable for engineers seeking a high-density, memory-rich FPGA platform that integrates many I/Os without expanding PCB complexity. Its RoHS compliance and defined core voltage range simplify system-level design and manufacturing planning.

Request a quote or submit an inquiry to receive pricing, availability, and technical support information for the 5SGXMA7N1F40C1N.

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