5SGXMA7K3F40I4N

The 5SGXMA7K3F40I4N is an Intel Stratix V GX field programmable gate array (FPGA) in a 1517-ball FCBGA package. This industrial-grade device delivers very-high-density programmable logic and abundant on-chip memory to support complex digital designs and I/O-intensive implementations.

With 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 696 user I/Os, the device targets demanding designs that require high logic capacity, large local RAM, and a broad I/O complement within a 40×40 1517-FBGA footprint. The device is RoHS compliant and rated for operation from –40 °C to 100 °C.

Key Features

• Core Logic  622,000 logic elements for high-density programmable logic and complex custom hardware implementations.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffer, packet, and data-structure storage directly in the fabric.
• I/O Capacity  696 user I/Os to accommodate wide parallel interfaces and mixed-signal board-level connectivity.
• Power Supply  Core voltage supply range from 820 mV to 880 mV for the device core rails.
• Package & Mounting  1517-BBGA (FCBGA) / supplier package 1517-FBGA (40×40) in a surface-mount footprint for compact board integration.
• Temperature & Grade  Industrial-grade device rated for operation from –40 °C to 100 °C.
• Compliance  RoHS compliant to meet standard environmental directives.

Typical Applications

• High-density digital systems  Implement complex custom logic and accelerators using 622,000 logic elements and extensive on-chip RAM.
• Data buffering and packet processing  Use approximately 51.2 Mbits of embedded memory for large FIFOs, packet buffers, and local data storage.
• I/O-rich interface hubs  Leverage 696 user I/Os to connect wide buses, parallel interfaces, and dense board-level peripherals.

Unique Advantages

• High logic density: 622,000 logic elements provide the capacity needed for sophisticated, multi-function designs without immediate partitioning.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependency and lowers system latency.
• Large I/O complement: 696 user I/Os let you implement wide parallel interfaces and dense interconnects on a single device.
• Industrial temperature rating: Operation from –40 °C to 100 °C supports deployment in temperature-challenging environments.
• Compact FCBGA packaging: 1517-FBGA (40×40) surface-mount package enables high-density board layouts while preserving signal routing options.
• Regulatory alignment: RoHS compliance simplifies environmental regulatory considerations in product builds.

Why Choose 5SGXMA7K3F40I4N?

The 5SGXMA7K3F40I4N combines a very large logic fabric, significant embedded memory, and extensive I/O in an industrial-rated Stratix V GX device. Its electrical and thermal specifications make it suitable for complex, high-density digital designs that require substantial on-chip resources while operating across a wide temperature range.

This device is well suited for teams designing advanced programmable hardware solutions that demand scalability in logic and memory, broad I/O, and a compact FCBGA package footprint. Its RoHS compliance and industrial temperature rating help ensure long-term deployment viability in a range of embedded applications.

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