5SGXMA7K3F40I3N

The 5SGXMA7K3F40I3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for industrial-grade FPGA applications. It delivers very high logic capacity, large on-chip memory, and extensive I/O resources in a 1517-ball FCBGA package.

Targeted at industrial systems that require high-density programmable logic and broad interfacing, this device combines 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 696 I/Os to support complex custom hardware functions and dense integration.

Key Features

• Logic Capacity — 622,000 logic elements to implement large-scale digital systems and complex algorithms.
• Logic Array Blocks — 234,720 logic array blocks provide structured building blocks for resource allocation and floorplanning.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support buffers, FIFOs, and large local storage without external memory.
• I/O Resources — 696 I/Os to accommodate high pin-count interfacing and multi-protocol system integration.
• Package & Mounting — 1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), surface-mount mounting for compact board-level integration.
• Power — Core voltage supply range: 820 mV to 880 mV, enabling defined core power domain design.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant — Meets current RoHS environmental requirements.

Typical Applications

• Industrial Control & Automation — Industrial temperature rating and large I/O counts make the device suitable for programmable control, motion control, and factory automation interfaces.
• High-Density Signal Processing — Large logic capacity and substantial on-chip RAM support DSP pipelines, packet processing, and real-time data manipulation.
• Communications & Networking Equipment — Extensive I/O resources and high logic density enable protocol handling, packet switching, and custom acceleration in network appliances.
• Custom Hardware Acceleration — Use the device to offload compute-intensive functions with large logic and memory resources for application-specific acceleration.

Unique Advantages

• Significant Logic Density: 622,000 logic elements allow implementation of large, integrated FPGA designs without partitioning across multiple devices.
• Large On-Chip Memory: Approximately 51.2 Mbits of embedded RAM reduces reliance on external memory for high-bandwidth buffering and state storage.
• Extensive I/O Count: 696 I/Os provide flexibility for multi-interface systems and dense connector layouts.
• Industrial Reliability: Industrial temperature rating (−40 °C to 100 °C) supports deployment in harsh and temperature-variable environments.
• Compact BGA Footprint: 1517-ball FCBGA (40×40) package balances high pin-count and compact PCB area for space-constrained designs.
• Defined Core Power Window: 820 mV–880 mV supply range provides clear parameters for power-supply design and thermal planning.

Why Choose 5SGXMA7K3F40I3N?

The 5SGXMA7K3F40I3N positions itself as a high-capacity, industrial-grade Stratix V GX FPGA designed for systems that demand large programmable logic, substantial embedded memory, and a high number of I/Os. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 696 I/Os makes it well suited for complex signal processing, communications, and industrial control applications.

With a surface-mount 1517-ball FCBGA package, a defined core voltage range, and RoHS compliance, this device supports dense hardware integration and application deployments across industrial temperature ranges, offering a scalable foundation for advanced FPGA-based designs.

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