5SGXMA7K3F40I3LN

The 5SGXMA7K3F40I3LN is an Intel Stratix V GX field programmable gate array (FPGA) provided in a 1517-BBGA FCBGA package. This device delivers large programmable logic capacity, substantial embedded memory, and a high I/O count in an industrial-grade surface-mount package.

Designed for systems that require extensive on-chip logic, significant embedded memory, and robust I/O capability, the device operates across an industrial temperature range and low core-voltage supply window to support demanding embedded and industrial applications.

Key Features

• Logic Capacity — 622,000 logic elements for implementing large-scale programmable logic designs.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive functions.
• I/O Density — 696 I/Os to accommodate high-pin-count interfaces and complex board-level connectivity.
• Power — Core voltage supply range from 820 mV to 880 mV for the device core.
• Package and Mounting — 1517-BBGA (supplier package listed as 1517-FBGA, 40×40) in a surface-mount form factor.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C.
• Standards Compliance — RoHS compliant.

Typical Applications

• Telecommunications & Networking — High logic and I/O counts support protocol processing, packet handling, and interface aggregation in networking equipment.
• High-density FPGA Designs — Large logic capacity and embedded memory enable complex algorithm implementations and hardware acceleration tasks.
• Industrial Control & Automation — Industrial temperature rating and robust I/O make the device suitable for control systems and factory automation boards.
• System Integration & Prototyping — Surface-mount 1517-BBGA package and abundant resources support prototype and system-level integration workflows.

Unique Advantages

• High logic density: 622,000 logic elements reduce the need for multiple devices in large FPGA designs.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM supports high-throughput buffering and state storage without external memory dependencies.
• Extensive I/O capacity: 696 I/Os enable direct interfacing to numerous peripherals, interfaces, and mezzanine connections.
• Industrial temperature range: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact surface-mount package: 1517-BBGA (1517-FBGA 40×40) allows high-density PCB layouts while maintaining reliability.
• Low-voltage core operation: 820–880 mV supply window helps manage core power delivery for system power budgeting.

Why Choose 5SGXMA7K3F40I3LN?

The 5SGXMA7K3F40I3LN combines a large logic fabric, sizable embedded memory, and broad I/O resources in an industrial-grade Stratix V GX FPGA package. Its specifications make it well suited for designs that demand substantial on-chip resources and reliable operation across a wide temperature range.

For engineering teams targeting complex, high-density FPGA implementations—particularly in industrial and communications applications—this device offers a balance of integration, I/O capability, and thermal tolerance to support long-term deployment and scalable designs.

Request a quote or submit a pricing and availability inquiry for part number 5SGXMA7K3F40I3LN to proceed with procurement or to obtain additional purchasing information.