5SGXMA7K3F40I3LG

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA

Quantity 766 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXMA7K3F40I3LG – Stratix® V GX FPGA IC, 622,000 logic elements, 1517-BBGA

The 5SGXMA7K3F40I3LG is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in a 1517-BBGA (1517‑FBGA, 40×40) surface-mount package. It delivers a large logic fabric and embedded memory capacity alongside a high pin count suitable for complex digital designs requiring substantial on-chip resources.

With 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 696 user I/O, this industrial-grade device is intended for designs that require dense logic, abundant local RAM, and extensive I/O connectivity. The device operates over a core supply range of 820 mV to 880 mV and an industrial temperature range of −40 °C to 100 °C.

Key Features

  • Core Logic  622,000 logic elements provide a large programmable fabric for implementing complex processors, accelerators, and custom logic blocks.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support memory-intensive algorithms, buffering, and state storage without external memory for many functions.
  • I/O Capacity  696 user I/O pins offer extensive interfacing options for parallel buses, high-density connectors, and mixed-signal front ends.
  • Package and Mounting  1517-BBGA (1517‑FBGA, 40×40) package in a surface-mount form factor for PCB-level integration in compact system designs.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet demanding thermal environments.
  • Core Supply Range  Operates on a core voltage supply between 820 mV and 880 mV, enabling designs that target the specified power envelope.
  • Standards and Compliance  RoHS compliant.
  • Documentation Support  Part of the Stratix V family; device electrical and switching characteristics are documented in the Stratix V Device Datasheet covering operating conditions, power, and I/O timing.

Typical Applications

  • High-density digital processing  Implement complex data-paths, custom accelerators, and parallel processing pipelines using the device’s large logic element count.
  • Memory-intensive algorithms  On-chip RAM capacity supports buffering, lookup tables, and stateful processing without immediate dependency on external memory for many functions.
  • High I/O systems  Use the 696 I/O pins to interface with multiple peripherals, sensor arrays, or wide parallel buses in system-level designs.
  • Industrial control and monitoring  Industrial temperature rating and robust packaging make the device suitable for control, automation, and instrumentation systems requiring reliable operation across a wide temperature range.

Unique Advantages

  • High logic density: 622,000 logic elements enable consolidation of multiple functions into a single device, reducing PCB count and design complexity.
  • Substantial on‑chip memory: Approximately 51.2 Mbits of embedded RAM lowers dependence on external memory for many buffering and storage use cases, improving latency and simplifying memory interfaces.
  • Extensive I/O connectivity: 696 user I/O pins give designers flexibility to connect wide buses, multi-channel interfaces, and parallel sensors without mediator chips.
  • Industrial temperature rating: Rated −40 °C to 100 °C for deployment in environments with wide thermal variation.
  • Compact BGA package: The 1517-BBGA (1517‑FBGA, 40×40) surface-mount package supports dense board layouts while maintaining accessibility to high I/O counts.
  • Standards compliance: RoHS compliance supports regulatory requirements for lead-free manufacturing processes.

Why Choose 5SGXMA7K3F40I3LG?

The 5SGXMA7K3F40I3LG positions itself for designs that demand a combination of large programmable logic capacity, significant on-chip memory, and plentiful I/O in an industrial-temperature-rated FPGA. Its specifications make it suitable for consolidating complex system functions onto a single Stratix V GX device while maintaining the environmental range and package density required for modern embedded systems.

Engineers specifying this device benefit from the Stratix V family documentation for electrical and switching characteristics, and from an Intel-manufactured FPGA solution that aligns with demanding digital, memory-centric, and high-I/O applications.

Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the 5SGXMA7K3F40I3LG.

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