5SGXMA7K3F40I3LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 766 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXMA7K3F40I3LG – Stratix® V GX FPGA IC, 622,000 logic elements, 1517-BBGA
The 5SGXMA7K3F40I3LG is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in a 1517-BBGA (1517‑FBGA, 40×40) surface-mount package. It delivers a large logic fabric and embedded memory capacity alongside a high pin count suitable for complex digital designs requiring substantial on-chip resources.
With 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 696 user I/O, this industrial-grade device is intended for designs that require dense logic, abundant local RAM, and extensive I/O connectivity. The device operates over a core supply range of 820 mV to 880 mV and an industrial temperature range of −40 °C to 100 °C.
Key Features
- Core Logic 622,000 logic elements provide a large programmable fabric for implementing complex processors, accelerators, and custom logic blocks.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support memory-intensive algorithms, buffering, and state storage without external memory for many functions.
- I/O Capacity 696 user I/O pins offer extensive interfacing options for parallel buses, high-density connectors, and mixed-signal front ends.
- Package and Mounting 1517-BBGA (1517‑FBGA, 40×40) package in a surface-mount form factor for PCB-level integration in compact system designs.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet demanding thermal environments.
- Core Supply Range Operates on a core voltage supply between 820 mV and 880 mV, enabling designs that target the specified power envelope.
- Standards and Compliance RoHS compliant.
- Documentation Support Part of the Stratix V family; device electrical and switching characteristics are documented in the Stratix V Device Datasheet covering operating conditions, power, and I/O timing.
Typical Applications
- High-density digital processing Implement complex data-paths, custom accelerators, and parallel processing pipelines using the device’s large logic element count.
- Memory-intensive algorithms On-chip RAM capacity supports buffering, lookup tables, and stateful processing without immediate dependency on external memory for many functions.
- High I/O systems Use the 696 I/O pins to interface with multiple peripherals, sensor arrays, or wide parallel buses in system-level designs.
- Industrial control and monitoring Industrial temperature rating and robust packaging make the device suitable for control, automation, and instrumentation systems requiring reliable operation across a wide temperature range.
Unique Advantages
- High logic density: 622,000 logic elements enable consolidation of multiple functions into a single device, reducing PCB count and design complexity.
- Substantial on‑chip memory: Approximately 51.2 Mbits of embedded RAM lowers dependence on external memory for many buffering and storage use cases, improving latency and simplifying memory interfaces.
- Extensive I/O connectivity: 696 user I/O pins give designers flexibility to connect wide buses, multi-channel interfaces, and parallel sensors without mediator chips.
- Industrial temperature rating: Rated −40 °C to 100 °C for deployment in environments with wide thermal variation.
- Compact BGA package: The 1517-BBGA (1517‑FBGA, 40×40) surface-mount package supports dense board layouts while maintaining accessibility to high I/O counts.
- Standards compliance: RoHS compliance supports regulatory requirements for lead-free manufacturing processes.
Why Choose 5SGXMA7K3F40I3LG?
The 5SGXMA7K3F40I3LG positions itself for designs that demand a combination of large programmable logic capacity, significant on-chip memory, and plentiful I/O in an industrial-temperature-rated FPGA. Its specifications make it suitable for consolidating complex system functions onto a single Stratix V GX device while maintaining the environmental range and package density required for modern embedded systems.
Engineers specifying this device benefit from the Stratix V family documentation for electrical and switching characteristics, and from an Intel-manufactured FPGA solution that aligns with demanding digital, memory-centric, and high-I/O applications.
Request a quote or submit an inquiry to obtain pricing, availability, and ordering information for the 5SGXMA7K3F40I3LG.

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