5SGXMB5R2F40C2N

The 5SGXMB5R2F40C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1517‑FBGA (40 × 40) surface‑mount package for commercial‑grade applications. This device provides a high logic capacity and substantial embedded memory combined with a large I/O count, intended for designs that require significant programmable logic and on‑chip storage within a compact BGA footprint.

Key Features

• Core Logic  Approximately 490,000 logic elements (cells) to implement complex digital logic and state machines.
• Logic Array Blocks  Device density supports a substantial number of programmable logic resources for high‑integration designs.
• Embedded Memory  Approximately 42 Mbits of on‑chip RAM for buffering, FIFOs, and memory‑intensive logic functions.
• I/O Count  432 available I/O pins to support wide host interfaces and multiple parallel connections.
• Power Supply  Core voltage operating range from 870 mV to 930 mV for the device core supply domain.
• Package & Mounting  1517‑FBGA (40 × 40) package, surface‑mount for PCB assembly and compact system integration.
• Operating Temperature  Commercial temperature grade rated from 0 °C to 85 °C.
• Compliance  RoHS‑compliant device suitable for lead‑free assemblies.

Typical Applications

• High‑density programmable logic systems  Implement large custom logic blocks and complex control functions using the device’s high logic element count.
• Memory‑intensive designs  Leverage approximately 42 Mbits of embedded RAM for data buffering, packet queues, and on‑chip storage.
• High‑I/O interface implementations  Use 432 I/Os to connect multiple parallel interfaces, I/O buses, or board‑level peripherals.
• Compact board designs  1517‑FBGA package enables integration of substantial logic and memory in space‑constrained PCBs.

Unique Advantages

• Large programmable capacity: 490,000 logic elements provide headroom for complex designs and integration of multiple subsystems on a single device.
• Significant on‑chip RAM: Approximately 42 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
• High I/O availability: 432 I/Os support broad connectivity options and parallel interface implementations without external multiplexing.
• Compact packaging: 1517‑FBGA (40 × 40) delivers high density in a surface‑mount form factor suitable for modern PCB layouts.
• Commercial temperature rating: Specified 0 °C to 85 °C operating range for standard commercial applications.
• RoHS compliant: Supports lead‑free assembly processes and environmental compliance requirements.

Why Choose 5SGXMB5R2F40C2N?

The 5SGXMB5R2F40C2N combines substantial logic density, significant embedded memory, and a high I/O count in a compact 1517‑FBGA package—making it well suited to commercial designs that require on‑chip resources and broad interfacing capability. Its specified core voltage range and commercial temperature rating provide clear design parameters for reliable deployment in standard operating environments.

This device is appropriate for engineering teams seeking to consolidate complex digital functions and memory into a single FPGA, reduce external component count, and maintain a compact board footprint.

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