5SGXMB5R2F40I3G

IC FPGA 432 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 41984000 490000 1517-FBGA (40x40)

Quantity 462 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-FBGA (40x40)Number of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits41984000

Overview of 5SGXMB5R2F40I3G – Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 41984000 490000 1517-FBGA (40x40)

The 5SGXMB5R2F40I3G is a Stratix V GX Field Programmable Gate Array supplied in a 1517-FBGA (40×40) surface-mount package and rated for industrial temperature operation. This device integrates a large programmable fabric with 490,000 logic elements (cells), approximately 42 Mbits of embedded memory, and 432 I/O pins to address complex digital design requirements.

Designed for applications that require high integration and flexible hardware implementation, the device operates from a core supply range of 820 mV to 880 mV and is RoHS compliant, with an operating temperature range of –40 °C to 100 °C.

Key Features

  • Programmable Logic  490,000 logic elements (cells) for large-scale custom logic implementation and parallel processing architectures.
  • Embedded Memory  Approximately 42 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms without external memory for many functions.
  • I/O Capacity  432 general-purpose I/O pins to support broad interfacing needs across high-density systems.
  • Transceiver Capability (Device Family)  Stratix V GX devices in the family include high-speed transceiver options (GX channel up to 14.1 Gbps in family documentation) for demanding serial communications.
  • Power Supply  Core voltage specification: 820 mV to 880 mV, enabling predictable power design and supply planning.
  • Package & Mounting  1517-FBGA (40×40) supplier device package, surface-mount mounting type for compact board designs.
  • Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C, suitable for industrial-environment deployments.
  • Regulatory  RoHS compliant, supporting regulatory and environmental requirements for lead-free assemblies.

Typical Applications

  • High-performance networking  Leverage the device family’s high-speed transceiver capability together with 432 I/Os and abundant logic to implement packet processing, switching, and line-rate interfaces.
  • Data-center acceleration  Use large logic capacity and embedded memory for custom acceleration engines and offload functions in compute and storage subsystems.
  • Signal processing and communications  Implement complex DSP pipelines and protocol handling using the on-chip RAM and dense logic resources.
  • Industrial control and instrumentation  Industrial temperature rating and extensive I/O enable rugged control, protocol bridging, and custom automation hardware.

Unique Advantages

  • High integration density: 490,000 logic elements provide substantial on-chip logic for consolidating multi-chip designs into a single FPGA.
  • Significant on-chip memory: Approximately 42 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
  • Broad I/O and package support: 432 I/Os in a compact 1517-FBGA (40×40) surface-mount package support dense board-level integration.
  • Industrial-ready thermal range: Rated from –40 °C to 100 °C for reliable operation in industrial environments.
  • Controlled core supply range: 820 mV to 880 mV core voltage specification aids in predictable power budgeting and thermal design.
  • RoHS compliant: Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose 5SGXMB5R2F40I3G?

The 5SGXMB5R2F40I3G combines large-scale programmable logic, abundant embedded memory, and extensive I/O in a compact FBGA package, positioning it for complex digital designs where integration and configurability matter. Its industrial temperature rating and RoHS compliance make it suitable for demanding deployments that require stability across a wide thermal range.

This device is appropriate for engineering teams building high-throughput communications systems, data-path accelerators, and industrial control platforms that benefit from on-chip memory, high logic density, and flexible I/O routing. The Stratix V GX family documentation further documents high-speed transceiver capabilities for serial communications use cases.

Request a quote or submit an inquiry to discuss availability, lead times, and pricing for the 5SGXMB5R2F40I3G. Our team can provide further technical details and support for integration into your design cycle.

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