5SGXMB5R2F40I3N

IC FPGA 432 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 41984000 490000 1517-FBGA (40x40)

Quantity 1,114 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-FBGA (40x40)Number of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits41984000

Overview of 5SGXMB5R2F40I3N – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMB5R2F40I3N is a Stratix V GX family field programmable gate array (FPGA) offered in an industrial temperature grade. It provides a high-capacity programmable fabric with large on-chip memory and a high I/O count for complex digital systems.

Designed for industrial and high-performance applications, this device targets designs that require substantial logic resources, multi-megabit embedded memory, and broad I/O connectivity while operating across an extended temperature range.

Key Features

  • High logic capacity — 490,000 logic elements to implement large-scale digital designs and complex custom logic functions.
  • Embedded memory — Approximately 42 Mbits of total on-chip RAM bits to support buffers, FIFOs, and large state machines.
  • Extensive I/O — 432 I/O pins for broad peripheral, memory, and high-density board-level connectivity.
  • Industrial temperature grade — Rated for operation from –40 °C to 100 °C, suitable for industrial environments and systems with extended temperature requirements.
  • Power supply range — Core voltage specified from 820 mV to 880 mV for predictable power planning and system integration.
  • Package and mounting — 1517-FBGA (40×40) supplier device package and surface-mount mounting for compact, board-level implementation.
  • Stratix V GX family characteristics — Part of the Stratix V GX device family, which includes devices with transceiver capability and documented electrical and switching characteristics for system designers.
  • RoHS compliant — Meets RoHS environmental requirements for lead-free manufacturing.

Typical Applications

  • Industrial control and automation — Use the device’s large logic capacity and extended temperature range to implement control engines, protocol bridges, and real-time processing in industrial systems.
  • Communications equipment — Leverage the Stratix V GX family characteristics and high I/O count for network infrastructure, packet processing, and interface aggregation tasks.
  • High-density digital systems — Deploy the combination of abundant logic elements and substantial embedded memory for compute-intensive FPGA roles such as acceleration, prototyping, and custom datapaths.

Unique Advantages

  • Large, integrated programmable fabric — 490,000 logic elements reduce the need for external CPLDs or multiple FPGAs in high-complexity designs.
  • Significant on-chip memory — Approximately 42 Mbits of embedded RAM supports large buffering and state storage without heavy external memory dependence.
  • High pin count for flexible interfacing — 432 I/Os enable diverse peripheral and mezzanine connections on compact boards.
  • Industrial-grade temperature tolerance — –40 °C to 100 °C rating supports deployments in demanding thermal environments.
  • Compact BGA package — 1517-FBGA (40×40) balances density and board area efficiency for space-constrained applications.
  • Standards-aware supply and compliance — Core supply specification (820 mV–880 mV) and RoHS compliance help streamline system-level design and manufacturing.

Why Choose 5SGXMB5R2F40I3N?

The 5SGXMB5R2F40I3N combines high logic density, multiple megabits of embedded RAM, and a large I/O complement in an industrial-grade Stratix V GX device package. It is suited for engineers building complex, memory- and I/O-intensive designs that require robust thermal performance and predictable core-voltage characteristics.

Selecting this device supports scalable designs that demand significant on-chip resources while maintaining board-level compactness and manufacturing compliance.

Request a quote or submit an inquiry to obtain pricing, availability, and technical support for the 5SGXMB5R2F40I3N.

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