5SGXMB5R2F43C2LG

The 5SGXMB5R2F43C2LG is an Intel Stratix® V GX field-programmable gate array (FPGA) provided in a 1760-FCBGA (42.5 × 42.5 mm) package for surface-mount assembly. It delivers a high logic and memory density with extensive I/O capability, targeted at designs that require large on-chip resources and dense system integration within commercial temperature environments.

Key Features

• Stratix V GX FPGA architecture  Implementations based on the Stratix V GX family—enabling integration of high-density programmable logic and on-chip resources.
• Logic capacity  Approximately 490,000 logic elements to support complex digital designs and large-scale programmable logic implementations.
• Embedded memory  Approximately 42 Mbits of on-chip RAM for data buffering, lookup tables, and state storage without external memory in some functions.
• I/O density  600 I/O pins to connect to multiple peripherals, high-pin-count subsystems, and dense board-level routing.
• Power and core supply  Core voltage supply range of 820 mV to 880 mV for compatibility with targeted power architectures and voltage regulation designs.
• Package & mounting  1760-FCBGA (1760-BBGA) package, 42.5 × 42.5 mm, designed for surface-mount assembly on compact, high-density PCBs.
• Operating grade and temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Environmental compliance  RoHS compliant to meet common regulatory and manufacturing requirements.

Typical Applications

• High-density digital processing  Use the large logic element count to implement complex state machines, datapaths, and custom processing blocks.
• On-chip buffering and memory functions  Leverage approximately 42 Mbits of embedded memory for packet buffering, FIFOs, and lookup tables.
• Multi-interface system integration  600 I/Os support connectivity to numerous peripherals, mezzanine modules, and board-level interfaces in a single device.

Unique Advantages

• High logic and memory density: Approximately 490,000 logic elements plus ~42 Mbits of embedded RAM reduce the need for multiple discrete devices.
• Extensive I/O capability: 600 I/Os simplify integration of complex, multi-channel systems and reduce board-level multiplexing.
• Compact, manufacturable package: 1760-FCBGA (42.5 × 42.5 mm) supports dense board layouts while maintaining surface-mount assembly compatibility.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation, aligned with standard commercial deployment environments.
• Regulatory readiness: RoHS compliance supports environmental and production requirements without additional component-level processing.

Why Choose 5SGXMB5R2F43C2LG?

The 5SGXMB5R2F43C2LG positions itself for commercial designs that demand a combination of very high logic capacity, substantial on-chip memory, and broad I/O connectivity in a single FPGA package. Its 1760-FCBGA form factor and defined core voltage range enable integration into compact, high-density systems while meeting standard commercial operating temperature requirements.

This device is well suited for engineering teams and procurement organizations seeking a highly integrated FPGA from the Stratix V GX family with verifiable on-chip resources and RoHS compliance for streamlined product development and manufacturing.

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