5SGXMB5R2F43C2G

IC FPGA 600 I/O 1760FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 41984000 490000 1760-BBGA, FCBGA

Quantity 49 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits41984000

Overview of 5SGXMB5R2F43C2G – Stratix® V GX FPGA, 1760-FCBGA (42.5×42.5 mm)

The 5SGXMB5R2F43C2G is a Stratix V GX field-programmable gate array (FPGA) from Intel supplied in a 1760-FCBGA package. It delivers a large programmable fabric with 490,000 logic elements and approximately 42 Mbits of embedded memory for complex digital designs.

With 600 user I/Os and a specified core supply range of 870 mV to 930 mV, this commercial-grade, surface-mount FPGA targets high-density logic implementations and systems that require extensive I/O and on-chip memory within a ball-grid array footprint. The device is RoHS compliant and rated for operation from 0 °C to 85 °C.

Key Features

  • Logic Capacity  Provides 490,000 logic elements suitable for large, complex designs that require substantial programmable logic resources.
  • Embedded Memory  Approximately 42 Mbits of on-chip RAM to support buffering, caching, and memory-intensive processing in-system.
  • I/O Density  600 user I/O pins to accommodate broad interfacing requirements across multiple high-pin-count peripherals and subsystems.
  • Package & Mounting  1760-BBGA / 1760-FCBGA package (42.5 × 42.5 mm) in a surface-mount form factor for board-level integration and high-density routing.
  • Power Supply  Specified core voltage range of 870 mV to 930 mV for compatibility with targeted system power architectures.
  • Temperature & Grade  Commercial-grade part with an operating range of 0 °C to 85 °C.
  • Regulatory  RoHS compliant.

Typical Applications

  • High-density digital systems  Large logic capacity and abundant I/Os enable complex state machines, packet processing, and custom datapath implementations.
  • Memory-backed processing  Approximately 42 Mbits of embedded RAM supports buffering and on-chip data storage for streaming or packetized data flows.
  • Board-level integration  1760-FCBGA package suits designs that require a high-pin-count FPGA in a compact BGA footprint for system-level integration.

Unique Advantages

  • Substantial programmable fabric: 490,000 logic elements provide capacity for sizeable custom logic and complex algorithm implementation without external logic expansion.
  • High on-chip memory: Approximately 42 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching tasks, simplifying BOM and board design.
  • Extensive I/O count: 600 user I/Os offer flexibility for connecting multiple peripherals, parallel interfaces, and high-pin-count daughtercards.
  • Ball-grid array package: 1760-FCBGA (42.5×42.5 mm) supports dense routing and compact system layouts while providing a robust surface-mount solution.
  • Commercial temperature rating: Rated for 0 °C to 85 °C to match commercial electronic product requirements.
  • Compliance-ready: RoHS compliance supports modern assembly and environmental requirements.

Why Choose 5SGXMB5R2F43C2G?

This Stratix V GX FPGA combines a high logic element count, substantial embedded memory, and a large I/O complement in a 1760-FCBGA package, making it well suited for dense, feature-rich digital systems where on-chip resources and I/O flexibility matter. Its commercial-grade rating and RoHS compliance align it with standard electronics manufacturing and deployment practices.

Design teams targeting large-scale programmable implementations that require significant internal RAM and broad interfacing can leverage this part to consolidate functions onto a single device, reduce external components, and streamline system architecture.

Request a quote or submit a pricing inquiry to receive availability and ordering information for 5SGXMB5R2F43C2G.

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