5SGXMB5R2F43C2N

The 5SGXMB5R2F43C2N is an Intel Stratix V GX family FPGA supplied in a 1760‑FBGA package (42.5 × 42.5 mm). This commercial‑grade, surface‑mount device provides a high logic capacity and large on‑chip memory for complex digital designs that require dense logic, extensive I/O, and embedded RAM resources.

Key value comes from its combination of 490,000 logic elements, approximately 42 Mbits of embedded memory, and 600 user I/Os, enabling integration of substantial digital functions in a single FPGA package while operating within a 0.87–0.93 V core supply and a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity 490,000 logic elements for implementing large, complex digital designs and custom processing pipelines.
• Embedded Memory Approximately 42 Mbits of on‑chip RAM to support frame buffers, FIFOs, and large state machines without external DRAM.
• I/O Density 600 user I/Os to interface with multiple peripherals, high‑speed SERDES endpoints, or wide parallel buses.
• Package & Mounting 1760‑BBGA / 1760‑FCBGA (42.5 × 42.5 mm) supplier device package, surface‑mount mounting for compact board integration.
• Power Core supply voltage range of 870 mV to 930 mV to match platform power planning and regulator selection.
• Operating Grade & Temperature Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• RoHS Compliance Device is RoHS compliant, supporting regulatory and environmental requirements for lead‑free assemblies.

Unique Advantages

• High logic integration: 490,000 logic elements reduce the need for multiple FPGAs, simplifying BOM and PCB routing for logic‑intensive designs.
• Substantial on‑chip RAM: Approximately 42 Mbits of embedded memory enables large buffers and state storage without relying solely on external memory components.
• Extensive I/O count: 600 I/Os provide flexibility to connect to a wide range of sensors, controllers, and high‑pin‑count interfaces directly.
• Compact BGA package: 1760‑FCBGA (42.5 × 42.5 mm) balances high resource density with a manageable PCB footprint for system integration.
• Commercial performance envelope: Rated for 0 °C to 85 °C operation and a defined core voltage window (0.87–0.93 V) to ease power and thermal planning for commercial systems.
• Regulatory readiness: RoHS compliance simplifies assembly and helps meet environmental requirements for new product introductions.

Why Choose 5SGXMB5R2F43C2N?

The 5SGXMB5R2F43C2N delivers a combination of high logic density, generous embedded memory, and broad I/O capability in a single Stratix V GX FPGA package. It is well suited for commercial applications that require consolidated digital functions, extensive buffering, and flexible interfacing while operating within standard commercial environmental limits.

This device is appropriate for engineering teams targeting high‑integration designs who need predictable power rails and a RoHS‑compliant BGA package for surface‑mount assembly. Its resources allow scaling of complex logic and memory‑intensive functions within one FPGA, supporting longer term design consolidation and platform reuse.

Request a quote or submit a product inquiry to evaluate 5SGXMB5R2F43C2N for your next design and to obtain pricing and availability information.