5SGXMB5R2F43I2G

IC FPGA 600 I/O 1760FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 41984000 490000 1760-BBGA, FCBGA

Quantity 1,758 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits41984000

Overview of 5SGXMB5R2F43I2G – Stratix V GX FPGA, 1760-FCBGA (Industrial)

The 5SGXMB5R2F43I2G is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1760-ball FCBGA package. It provides high logic capacity and large on-chip memory in a surface-mount, industrial-grade device designed for dense, I/O-rich digital designs.

With hundreds of I/O pins, substantial embedded memory and a low-voltage core supply range, this device targets high-density logic implementations and systems that require broad external interfacing and industrial temperature capability.

Key Features

  • Logic Capacity  Approximately 490,000 logic elements to implement complex digital functions and large-scale FPGA designs.
  • Embedded Memory  Approximately 42 Mbits of on-chip RAM for data buffering, FIFOs and intermediate storage without external memory.
  • I/O Density  600 user I/O pins to support multiple high-pin-count interfaces and extensive board-level connectivity.
  • Package  1760-ball FCBGA (1760-FCBGA, 42.5 × 42.5 mm) surface-mount package for high-pin-count, compact board integration.
  • Power  Core supply range of 870 mV to 930 mV to match targeted core-voltage rails and system power domains.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for thermally demanding environments.
  • Compliance  RoHS-compliant manufacturing.

Typical Applications

  • High-density digital processing  Use the large logic element count and embedded memory to implement complex signal processing, compute kernels or custom accelerators.
  • I/O-intensive systems  Leverage 600 I/Os for multi-protocol interfacing, board-level routing and high connector count applications.
  • Industrial control and automation  Industrial temperature rating and robust package make this device suitable for control systems and factory automation equipment.
  • System integration and prototyping  High integration density and FCBGA packaging simplify consolidation of functions onto fewer devices during system development.

Unique Advantages

  • Massive programmable logic: Approximately 490k logic elements enable implementation of large, complex designs without partitioning across multiple devices.
  • Substantial on-chip memory: Approximately 42 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage, simplifying board design.
  • Extensive external connectivity: 600 I/Os provide flexibility to connect to a wide variety of peripherals, PHYs and board-level interfaces.
  • Industrial readiness: −40 °C to 100 °C operating range and industrial grade classification support deployment in temperature-challenging environments.
  • Compact, high-density package: 1760-FCBGA (42.5 × 42.5 mm) package balances pin count and PCB area for dense system designs.
  • Low-voltage core operation: Core supply from 870 mV to 930 mV aligns with modern low-voltage power domains to optimize system power distribution.

Why Choose 5SGXMB5R2F43I2G?

The 5SGXMB5R2F43I2G delivers a blend of high logic capacity, sizable embedded memory and very high I/O count in an industrial-grade Stratix V GX FPGA. It is positioned for engineers who need to consolidate complex logic, large state machines or memory-heavy functions into a single, surface-mount, high-pin-count device while maintaining operation across a wide temperature range.

Backed by Stratix V device documentation, this part is suitable for designs that prioritize integration density, robust thermal performance and extensive board-level interfacing.

Request a quote or submit an inquiry to obtain pricing, lead time and additional technical support for 5SGXMB5R2F43I2G.

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