5SGXMB5R2F43I2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 41984000 490000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,758 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 41984000 |
Overview of 5SGXMB5R2F43I2G – Stratix V GX FPGA, 1760-FCBGA (Industrial)
The 5SGXMB5R2F43I2G is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1760-ball FCBGA package. It provides high logic capacity and large on-chip memory in a surface-mount, industrial-grade device designed for dense, I/O-rich digital designs.
With hundreds of I/O pins, substantial embedded memory and a low-voltage core supply range, this device targets high-density logic implementations and systems that require broad external interfacing and industrial temperature capability.
Key Features
- Logic Capacity Approximately 490,000 logic elements to implement complex digital functions and large-scale FPGA designs.
- Embedded Memory Approximately 42 Mbits of on-chip RAM for data buffering, FIFOs and intermediate storage without external memory.
- I/O Density 600 user I/O pins to support multiple high-pin-count interfaces and extensive board-level connectivity.
- Package 1760-ball FCBGA (1760-FCBGA, 42.5 × 42.5 mm) surface-mount package for high-pin-count, compact board integration.
- Power Core supply range of 870 mV to 930 mV to match targeted core-voltage rails and system power domains.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, suitable for thermally demanding environments.
- Compliance RoHS-compliant manufacturing.
Typical Applications
- High-density digital processing Use the large logic element count and embedded memory to implement complex signal processing, compute kernels or custom accelerators.
- I/O-intensive systems Leverage 600 I/Os for multi-protocol interfacing, board-level routing and high connector count applications.
- Industrial control and automation Industrial temperature rating and robust package make this device suitable for control systems and factory automation equipment.
- System integration and prototyping High integration density and FCBGA packaging simplify consolidation of functions onto fewer devices during system development.
Unique Advantages
- Massive programmable logic: Approximately 490k logic elements enable implementation of large, complex designs without partitioning across multiple devices.
- Substantial on-chip memory: Approximately 42 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage, simplifying board design.
- Extensive external connectivity: 600 I/Os provide flexibility to connect to a wide variety of peripherals, PHYs and board-level interfaces.
- Industrial readiness: −40 °C to 100 °C operating range and industrial grade classification support deployment in temperature-challenging environments.
- Compact, high-density package: 1760-FCBGA (42.5 × 42.5 mm) package balances pin count and PCB area for dense system designs.
- Low-voltage core operation: Core supply from 870 mV to 930 mV aligns with modern low-voltage power domains to optimize system power distribution.
Why Choose 5SGXMB5R2F43I2G?
The 5SGXMB5R2F43I2G delivers a blend of high logic capacity, sizable embedded memory and very high I/O count in an industrial-grade Stratix V GX FPGA. It is positioned for engineers who need to consolidate complex logic, large state machines or memory-heavy functions into a single, surface-mount, high-pin-count device while maintaining operation across a wide temperature range.
Backed by Stratix V device documentation, this part is suitable for designs that prioritize integration density, robust thermal performance and extensive board-level interfacing.
Request a quote or submit an inquiry to obtain pricing, lead time and additional technical support for 5SGXMB5R2F43I2G.

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