5SGXMB5R2F43I2LG

IC FPGA 600 I/O 1760FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 41984000 490000 1760-BBGA, FCBGA

Quantity 152 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits41984000

Overview of 5SGXMB5R2F43I2LG – Stratix® V GX FPGA, 490,000 logic elements, 1760-FCBGA

The 5SGXMB5R2F43I2LG is an Intel Stratix® V GX field-programmable gate array (FPGA) in a 1760-FCBGA package. This industrial-grade FPGA integrates a high-density programmable fabric with approximately 42 Mbits of on-chip RAM, up to 600 I/O pins, and a broad operating temperature range suited for demanding embedded and communications systems.

Designed for applications that require large logic capacity and flexible I/O in a compact surface-mount package, this device combines high logic element counts with industrial operating characteristics and RoHS compliance.

Key Features

  • Programmable Logic Capacity  Approximately 490,000 logic elements provide substantial programmable fabric for complex digital designs.
  • Embedded Memory  Approximately 42 Mbits of on-chip RAM for buffering, FIFOs, and on-chip data storage.
  • I/O Density  Up to 600 I/O pins support extensive external interfacing and multi-channel connectivity.
  • Package and Mounting  1760-FCBGA (42.5 × 42.5 mm) package in a surface-mount format suits high-density PCB designs.
  • Power Supply  Core supply range from 820 mV to 880 mV to match system power-rail designs.
  • Thermal and Environmental  Industrial operating temperature range of –40 °C to 100 °C and RoHS compliance for regulated environments.
  • Stratix V GX Family Capabilities  Stratix V GX devices are offered in commercial and industrial temperature grades and support transceiver speed grades documented in the Stratix V family datasheet.

Typical Applications

  • High‑performance Communications  Large logic capacity and family transceiver offerings make the device suitable for systems requiring substantial protocol processing and high-speed links.
  • Industrial Automation  Industrial temperature rating (–40 °C to 100 °C) and robust I/O count enable deployment in industrial control and machine-automation equipment.
  • Embedded Compute and Acceleration  High logic element count and significant embedded memory support custom hardware accelerators and complex signal processing functions.
  • Multi‑I/O Interface Hubs  Up to 600 I/Os allow aggregation and bridging of multiple sensors, transceivers, and peripheral domains on a single device.

Unique Advantages

  • High Logic Density:  Approximately 490,000 logic elements reduce the need for multi‑device partitioning in large FPGA designs.
  • Substantial On‑Chip Memory:  Approximately 42 Mbits of embedded RAM enable extensive buffering and on-chip data manipulation without external memory for many use cases.
  • Extensive I/O Capability:  600 available I/Os simplify system-level integration and reduce board complexity when connecting multiple interfaces.
  • Industrial Temperature Range:  Rated from –40 °C to 100 °C for reliable operation in temperature-challenging environments.
  • Compact, High‑Pin‑Count Package:  1760-FCBGA (42.5 × 42.5 mm) provides a dense pinout in a surface-mount form factor for space-constrained PCBs.
  • Standards‑oriented Family Design:  As part of the Stratix V GX family, the device benefits from documented transceiver and electrical characteristic specifications in the family datasheet.

Why Choose 5SGXMB5R2F43I2LG?

This Stratix V GX FPGA delivers a combination of high logic density, significant embedded memory, and extensive I/O in an industrial-grade, RoHS‑compliant package. Its 1760-FCBGA footprint and surface-mount mounting type make it suitable for compact, high-performance designs that must operate across a wide temperature range.

Engineers and procurement teams looking for a scalable, high-capacity programmable platform will find this device appropriate for complex communications, industrial, and embedded compute applications where integration density and environmental robustness are key selection criteria.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXMB5R2F43I2LG.

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