5SGXMB5R2F43I3LG

The 5SGXMB5R2F43I3LG is an Intel Stratix® V GX field programmable gate array (FPGA) offered in an industrial temperature grade. It combines high logic density and substantial on-chip memory with a large I/O count in a 1760-ball FCBGA package for designs that require extensive programmable logic and flexible I/O connectivity.

Targeted at complex digital systems and industrial applications, this device provides a balance of capacity and I/O resources while operating across a wide temperature range and a low core voltage domain.

Key Features

• Logic Capacity  Approximately 490,000 logic elements to implement complex, high-density digital designs.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM for buffering, lookup tables, and data storage close to logic.
• I/O Resources  600 user I/Os to support extensive external connectivity and multi-interface designs.
• Package  1760-FCBGA (42.5 × 42.5 mm) surface-mount package for compact board integration with high pin count.
• Power Supply  Core operating voltage range of 820 mV to 880 mV for the device’s core domain.
• Temperature and Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control and Automation  High logic density and industrial temperature grading make this device suitable for embedded control systems and programmable automation controllers.
• High-Density Digital Processing  Large logic element count and significant on-chip RAM enable implementation of dense processing pipelines and custom accelerators.
• Network and Telecom Infrastructure  Stratix V GX family capabilities and abundant I/O support applications requiring complex protocol handling and high-speed connectivity.

Unique Advantages

• High Logic Integration: Approximately 490,000 logic elements allow consolidation of large, multi-function designs into a single device.
• Substantial On-Chip Memory: Approximately 42 Mbits of embedded memory reduces external memory dependencies and improves data locality.
• Extensive I/O Count: 600 I/Os give flexibility for interfacing to numerous peripherals, multi-lane interfaces, or dense connector systems.
• Industrial Temperature Range: Rated −40 °C to 100 °C to support operation in demanding environmental conditions.
• Compact High-Pin Package: 1760-FCBGA package delivers a high pin density in a manageable board footprint for space‑constrained designs.
• Low-Voltage Core Domain: 820–880 mV core supply enables integration into low-voltage system power domains.

Why Choose 5SGXMB5R2F43I3LG?

The 5SGXMB5R2F43I3LG positions itself for projects that demand significant programmable logic, abundant embedded memory, and a high number of I/Os while meeting industrial temperature requirements. Its Stratix V GX pedigree and the combination of capacity and I/O make it well suited to consolidating complex functions on a single FPGA for industrial, communications, and high-density digital processing designs.

Choosing this device supports scalable system architectures where long-term availability, high integration, and compliance with RoHS are priorities. The part is appropriate for engineering teams seeking a high-capacity FPGA with industrial-grade operating range and a compact, high-pin-count package.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXMB5R2F43I3LG for your next design.