5SGXMB5R2F43I3N

IC FPGA 600 I/O 1760FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 41984000 490000 1760-BBGA, FCBGA

Quantity 623 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits41984000

Overview of 5SGXMB5R2F43I3N – Stratix® V GX FPGA IC 1760-FCBGA (42.5 × 42.5)

The 5SGXMB5R2F43I3N is a Stratix® V GX field-programmable gate array (FPGA) in a 1760‑ball FCBGA package. It delivers large programmable logic capacity, substantial embedded memory, and a high I/O count in an industrial-grade device targeted at designs that require dense on-chip resources and robust operating temperature range.

As a member of the Stratix V GX family, this device is intended for systems that need extensive logic, abundant I/Os, and on-chip RAM for complex control, signal processing, or interface aggregation tasks.

Key Features

  • Core logic capacity  Approximately 490,000 logic elements to implement large, complex designs on a single device.
  • Embedded memory  Approximately 42 Mbits of on-chip RAM for buffering, LUT-based storage, and on-chip data structures without immediate dependence on external memory.
  • I/O resources  600 user I/O pins to support wide peripheral connectivity, parallel interfaces, and dense board-level routing.
  • Power  Core supply voltage range of 0.820 V to 0.880 V for defined core operating conditions.
  • Package & mounting  1760‑ball FCBGA (42.5 × 42.5 mm) surface-mount package for high-density board integration.
  • Industrial temperature grade  Specified operating range from −40 °C to 100 °C for industrial application environments.
  • Compliance  RoHS‑compliant device for worldwide regulatory preference.

Typical Applications

  • Industrial control and automation  Large logic capacity and industrial temperature rating support complex control algorithms, I/O aggregation, and sensor/actuator interfacing in factory and process environments.
  • High-density interface hubs  600 I/Os and substantial on-chip RAM enable consolidation of multiple peripheral interfaces and protocol bridging on a single FPGA.
  • Signal processing and acceleration  Approximately 490,000 logic elements and ~42 Mbits of embedded memory provide the resources for hardware-accelerated processing and buffering tasks.

Unique Advantages

  • Large integrated logic and memory: The combination of ~490k logic elements and ~42 Mbits of embedded RAM reduces the need for external programmable logic or memory components.
  • Extensive I/O count: 600 I/Os simplify board-level design by enabling many direct interfaces without additional multiplexing hardware.
  • Industrial-grade operation: Specified for −40 °C to 100 °C operation to maintain function in demanding environmental conditions.
  • Compact, high-density package: 1760‑ball FCBGA (42.5 × 42.5 mm) balances high integration density with PCB routing considerations.
  • Defined core power envelope: Core supply range of 0.820–0.880 V provides clear power design targets for system-level power budgeting.
  • RoHS compliant: Meets environmental compliance requirements for modern electronics manufacturing.

Why Choose 5SGXMB5R2F43I3N?

The 5SGXMB5R2F43I3N positions itself as a high-capacity, industrial-grade Stratix V GX FPGA suitable for designs that need large on-chip logic, significant embedded RAM, and a broad I/O set in a single-package solution. Its industrial operating range and RoHS compliance make it appropriate for long-life production systems deployed in challenging environments.

Design teams targeting consolidation of interfaces, hardware-accelerated processing, or extensive control logic will find the device’s combination of resources and defined core supply requirements useful for system-level optimization and predictable integration.

Request a quote or submit a sales inquiry to evaluate 5SGXMB5R2F43I3N for your next design.

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