5SGXMB5R2F43I3LN

The 5SGXMB5R2F43I3LN is a Stratix® V GX field programmable gate array (FPGA) in a 1760‑ball FCBGA package designed for high‑density, industrial‑grade designs. It delivers substantial on‑chip resources—approximately 490,000 logic elements and roughly 42 Mbits of embedded memory—along with 600 user I/Os to support complex digital systems and dense I/O requirements.

With an industrial operating temperature range and a low core voltage window, this device is targeted at applications that require high integration, robust thermal tolerance, and significant logic and memory capacity in a surface‑mount FCBGA footprint.

Key Features

• Core Logic  Approximately 490,000 logic elements and 185,000 logic array blocks provide capacity for large, multi‑function FPGA designs.
• Embedded Memory  Approximately 42 Mbits of on‑chip RAM for buffering, frame storage, and algorithmic data processing without heavy external memory dependence.
• I/O Density  600 user I/Os to support wide parallel interfaces, multi‑lane peripherals, and extensive sensor or module connectivity.
• Package & Mounting  1760‑ball FCBGA (1760‑BBGA) package, supplier device package 1760‑FCBGA (42.5 × 42.5 mm), designed for surface‑mount assembly.
• Power  Core supply specified between 820 mV and 880 mV to match system power‑rail planning and regulator selection.
• Temperature & Grade  Industrial grade with an operating temperature range from −40 °C to 100 °C for reliable performance in demanding ambient conditions.
• Environmental Compliance  RoHS compliant to support modern manufacturing and regulatory requirements.

Typical Applications

• High‑density digital systems  Use the large logic element count and significant embedded memory for complex state machines, protocol engines, and algorithm acceleration.
• Data aggregation and I/O bridging  600 I/Os enable integration of multiple high‑pin interfaces, sensor arrays, and parallel peripherals in a single device.
• Industrial control and automation  Industrial temperature rating and robust FCBGA packaging support deployment in factory automation and process control equipment.

Unique Advantages

• High integration density: The combination of ~490k logic elements and ~42 Mbits of on‑chip RAM reduces dependence on external components and simplifies board design.
• Extensive I/O capability: 600 user I/Os allow broad system interfacing without multiplexing compromises, easing system partitioning and PCB routing.
• Industrial operating range: Rated from −40 °C to 100 °C for reliable operation across a wide set of environmental conditions.
• Compact, manufacturable package: 1760‑FCBGA (42.5 × 42.5 mm) surface‑mount package supports high‑density PCB layouts while meeting assembly workflows.
• Low core voltage operation: Narrow 820–880 mV core supply window aids in power budgeting and selection of efficient regulators.
• Regulatory readiness: RoHS compliance simplifies integration into modern production environments that require lead‑free materials.

Why Choose 5SGXMB5R2F43I3LN?

The 5SGXMB5R2F43I3LN combines a large logic fabric, substantial embedded memory, and high I/O density in an industrial‑rated FCBGA package—making it well suited for engineers building complex digital systems that demand on‑board resources and robust environmental tolerance. Its narrow core voltage range and RoHS compliance simplify power design and manufacturing compliance.

This FPGA fits designs that require scaleable logic resources, dense peripheral connectivity, and deployment in industrial temperature environments, offering a balance of integration and design flexibility within the Stratix V GX family.

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