5SGXMB5R2F43I2N

The 5SGXMB5R2F43I2N is an industrial‑grade Stratix® V GX field programmable gate array (FPGA) IC from Intel. It provides a large logic fabric and substantial on‑chip memory in a high‑density 1760‑FBGA (1760‑FCBGA, 42.5×42.5 mm) package for board‑level integration.

Designed for applications that require high logic capacity, extensive I/O, and extended operating temperature, this device combines 490,000 logic elements, approximately 42 Mbits of embedded memory, and 600 I/Os to address demanding digital processing and system integration tasks.

Key Features

• Logic Capacity  490,000 logic elements for large, complex digital designs and multi‑function implementations.
• Embedded Memory  Approximately 42 Mbits of on‑chip RAM to support buffering, FIFOs, and embedded data storage.
• I/O Density  600 programmable I/Os to accommodate high‑pin‑count interfaces and board‑level connectivity.
• Package  1760‑FCBGA package (42.5 × 42.5 mm) for compact, high‑density PCB mounting.
• Power  Core voltage supply range of 870 mV to 930 mV for defined operating conditions.
• Temperature Range  Industrial operating range from −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Mounting  Surface mount device suitable for automated PCB assembly.
• Compliance  RoHS‑compliant for regulatory adherence in restricted substances environments.
• Family‑Level Characteristics  Part of the Stratix V GX family; refer to the Stratix V device datasheet for series‑level electrical and transceiver characteristics and speed grade information.

Typical Applications

• High‑density digital processing  Large logic capacity and embedded RAM enable complex datapath and control logic implementations for compute and signal processing tasks.
• Board‑level system integration  High I/O count and a dense FCBGA package support integration of multiple interfaces and peripherals on a single PCB.
• Industrial control and automation  Industrial temperature rating (−40 °C to 100 °C) and robust package make it suitable for control systems operating in harsh environments.
• Prototyping and development  Stratix V GX family characteristics provide a platform for validating complex system architectures and high‑logic designs.

Unique Advantages

• Large, scalable logic fabric: 490,000 logic elements provide the headroom needed for complex, multi‑module designs and future feature expansion.
• Substantial on‑chip RAM: Approximately 42 Mbits of embedded memory reduces reliance on external memory for many buffering and storage needs.
• High I/O integration: 600 I/Os simplify board routing and enable extensive peripheral and interface support without additional interface chips.
• Industrial temperature capability: Rated from −40 °C to 100 °C to meet thermal requirements of industrial and temperature‑sensitive applications.
• Compact, high‑density package: 1760‑FCBGA (42.5×42.5 mm) balances I/O count and board footprint for dense system designs.
• Defined core supply range: 870 mV to 930 mV operating voltage provides clear power design parameters for system integrators.
• RoHS compliance: Meets restricted substances requirements for many global markets and manufacturing processes.

Why Choose 5SGXMB5R2F43I2N?

The 5SGXMB5R2F43I2N positions itself as a high‑capacity, industrial‑grade FPGA option within the Stratix V GX family. Its combination of nearly half a million logic elements, substantial embedded memory, and 600‑pin I/O density offers system designers the resources to consolidate functions, reduce external component count, and implement complex, high‑throughput designs.

Ideal for engineering teams working on advanced digital systems, industrial automation, and board‑level integration projects, this device provides a clear specification set for power, thermal, and package planning—backed by the Stratix V device documentation for series‑level electrical and transceiver characteristics.

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