5SGXMB5R3F40C2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 41984000 490000 1517-FBGA (40x40) |
|---|---|
| Quantity | 415 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-FBGA (40x40) | Number of I/O | 432 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 41984000 |
Overview of 5SGXMB5R3F40C2G – Stratix® V GX FPGA, 1517-FBGA (40×40)
The 5SGXMB5R3F40C2G is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1517-FBGA (40×40) package. Designed as a high-density, reconfigurable logic device, it provides substantial on-chip resources for complex digital systems.
This commercial-grade FPGA integrates a large logic fabric, significant embedded memory, and extensive I/O capability, supporting designs that require high integration density and configurable hardware acceleration.
Key Features
- Logic Capacity 490,000 logic elements for implementing large-scale digital designs and custom hardware functions.
- Embedded Memory Approximately 42 Mbits of on-chip RAM to support buffering, state storage, and memory-hungry algorithms.
- I/O Resources 432 user I/O pins to interface with external peripherals, memory, and system buses.
- Package & Mounting 1517-FBGA (40×40) surface-mount package that supports high-density board integration.
- Power Supply Core voltage supply range of 870 mV to 930 mV for defined power-domain design and budgeting.
- Temperature Grade Commercial operating temperature range of 0 °C to 85 °C.
- Standards & Compliance RoHS compliant, meeting common environmental material requirements.
- Stratix V GX Series Characteristics As a Stratix V GX device, the family-level documentation lists transceiver speed grade options and detailed electrical characteristics for system design and verification.
Typical Applications
- High-density digital processing Use the large logic capacity and embedded memory for complex signal processing, protocol handling, and hardware acceleration tasks.
- Custom I/O interfaces Leverage 432 I/O pins to implement multiple parallel interfaces, bridging, and system-level glue logic.
- Prototyping and system integration Surface-mount BGA packaging and extensive resources make this device suitable for advanced prototype boards and integration into production systems.
Unique Advantages
- High logic density: 490,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing external components.
- Substantial embedded memory: Approximately 42 Mbits of on-chip RAM reduces dependency on external memory for many buffering and state-storage requirements.
- Extensive I/O capability: 432 I/O pins provide flexibility to connect to a wide range of peripherals and system interfaces without additional bridge ICs.
- Commercial grade and RoHS compliant: Commercial temperature rating and RoHS compliance support standard electronics manufacturing and environmental requirements.
- Well-documented series characteristics: Stratix V GX family datasheet provides detailed electrical and switching characteristics to support system-level design and verification.
Why Choose 5SGXMB5R3F40C2G?
The 5SGXMB5R3F40C2G positions itself as a high-capacity, commercial-grade FPGA for designs requiring substantial programmable logic, on-chip memory, and broad I/O resources in a compact BGA package. Its defined core voltage range and documented series electrical characteristics assist in predictable power and signal budgeting during development.
This part is suitable for engineers and teams building integrated digital systems that demand consolidation of functions, significant memory resources, and flexible I/O without moving to industrial temperature grades.
If you would like pricing, availability, or a formal quote for the 5SGXMB5R3F40C2G, request a quote or submit an inquiry to begin the procurement process.

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