5SGXMB5R3F40C2N

The 5SGXMB5R3F40C2N is a Stratix® V GX field programmable gate array (FPGA) in a 1517‑FBGA (40×40) surface‑mount package. It provides a large logic fabric, substantial embedded memory, and a high I/O count for complex, reprogrammable digital designs.

Designed for commercial temperature operation, this device is suited to applications that require significant on‑chip resources and flexible I/O in a compact BGA footprint.

Key Features

• Logic Capacity  490,000 logic elements (cells) to implement large-scale custom logic and control functions.
• Embedded Memory  Approximately 42 Mbits of on‑chip RAM for buffering, on‑chip data storage, and memory‑intensive logic.
• I/O Resources  432 general‑purpose I/O pins to support multiple parallel interfaces and high‑pin‑count board designs.
• Power Supply  Core voltage range of 870 mV to 930 mV suitable for low‑voltage core operation.
• Package & Mounting  1517‑FBGA (40×40) package, surface mount, enabling a compact board footprint for high‑density systems.
• Operating Temperature & Grade  Commercial grade with an operating range of 0 °C to 85 °C.
• RoHS Compliance  RoHS compliant to meet standard environmental requirements.

Typical Applications

• Large‑scale logic implementations  Devices that require extensive programmable logic can leverage the 490,000 logic elements for complex finite state machines, datapaths, and control logic.
• On‑chip buffering and memory‑intensive functions  Applications that need significant embedded RAM for FIFOs, frame buffering, or intermediate data storage benefit from approximately 42 Mbits of on‑chip memory.
• High‑pin‑count system interfaces  Systems requiring many parallel or multiplexed signals can use the 432 I/O lines for board‑level connectivity and interface consolidation.

Unique Advantages

• Large logic resource pool: 490,000 logic elements offer capacity for extensive custom logic without immediate external logic expansion.
• Substantial embedded memory: Approximately 42 Mbits of on‑chip RAM reduces dependency on external memory for many buffering and storage needs.
• High I/O availability: 432 I/O pins enable complex interface routing and parallel signal connectivity in a single device.
• Compact BGA package: 1517‑FBGA (40×40) delivers high density in a surface‑mount form factor suitable for space‑constrained boards.
• Low‑voltage core operation: 870–930 mV supply range aligns with low‑voltage system design practices.
• RoHS compliant: Helps meet common environmental and regulatory requirements for electronic assemblies.

Why Choose 5SGXMB5R3F40C2N?

The 5SGXMB5R3F40C2N combines a large logic fabric, substantial embedded RAM, and a high I/O count in a compact 1517‑FBGA package, making it suitable for commercial designs that require dense, reconfigurable logic and on‑chip memory. Its defined operating voltage and temperature range provide clear integration parameters for system designers.

This Stratix V GX device is appropriate for development teams and procurement groups seeking a high‑capacity FPGA solution with documented electrical characteristics and package specifications backed by the Stratix V device datasheet.

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