5SGXMB5R3F40C3N

The 5SGXMB5R3F40C3N is a Stratix V GX Field Programmable Gate Array (FPGA) IC delivering a high-density programmable fabric for complex digital designs. It integrates 490,000 logic elements and approximately 42 Mbits of embedded memory in a 1517-FBGA (40×40) surface-mount package with 432 user I/Os.

Designed for commercial temperature environments, this device operates from a core voltage range of 820 mV to 880 mV and is rated for 0 °C to 85 °C. The device is RoHS compliant and intended where high logic capacity, substantial on-chip memory, and large I/O counts are required.

Key Features

• Core Density  490,000 logic elements provide a large programmable fabric for implementing complex digital systems and high-logic-count designs.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive algorithms.
• I/O Resources  432 user I/Os enable broad interfacing and high channel counts for system-level connectivity.
• Power  Core supply operating range from 820 mV to 880 mV to match system power rails and design requirements.
• Package & Mounting  1517-FBGA (40×40) package in a surface-mount form factor for board-level high-density integration.
• Temperature & Grade  Commercial-grade device rated for operation from 0 °C to 85 °C.
• Standards & Compliance  RoHS compliant, supporting environmental regulatory requirements for many commercial products.
• Family-Level Capabilities  As a Stratix V GX device, the series defines GX transceiver speed grades in the family datasheet; refer to the Stratix V family documentation for transceiver and series-level electrical characteristics.

Typical Applications

• High-density system integration  Large logic capacity and embedded memory make the device suitable for integrating multiple functions into a single FPGA fabric.
• Multi-channel I/O designs  432 I/Os support designs that require extensive external interfacing, parallel data paths, or board-level aggregation.
• Memory-intensive processing  Approximately 42 Mbits of embedded RAM supports buffering, packet handling, and on-chip data staging for algorithm acceleration.
• Complex prototyping and development  High logic element count enables prototyping of large systems and iterative hardware development in commercial temperature environments.

Unique Advantages

• Large programmable fabric: 490,000 logic elements give designers the headroom to implement complex state machines, datapaths, and custom accelerators without immediate partitioning.
• Significant on-chip memory: Approximately 42 Mbits of embedded RAM reduces dependence on external memory for many buffering and queuing tasks, simplifying board design.
• High I/O count: 432 user I/Os enable flexible interfacing to numerous peripherals, sensors, and high-channel-count systems.
• Compact surface-mount package: The 1517-FBGA (40×40) package provides a compact footprint for high-density PCB layouts while supporting extensive connectivity.
• Commercial temperature rating: Rated for 0 °C to 85 °C, suitable for a wide range of standard commercial applications.
• Environmentally compliant: RoHS compliance supports regulatory requirements for commercial products.

Why Choose 5SGXMB5R3F40C3N?

The 5SGXMB5R3F40C3N delivers a combination of high logic capacity, substantial embedded memory, and extensive I/O resources in a compact 1517-FBGA package. It is positioned for designers who need a robust programmable platform for complex digital systems, multi-channel interfacing, and memory-demanding functions within commercial temperature ranges.

Backed by the Stratix V GX family documentation, this FPGA is appropriate for projects that require scalable logic resources and board-level integration while maintaining RoHS compliance and conventional commercial operating conditions.

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