5SGXMB5R3F40I3LG

The 5SGXMB5R3F40I3LG is an Intel Stratix V GX family FPGA device delivered in a 1517‑FBGA (40×40) surface‑mount package. It provides very high logic density and significant on‑chip memory, targeting designs that require large programmable fabric, extensive I/O, and industrial temperature operation.

As a member of the Stratix V GX series, the device is part of a family described in the series datasheet with defined transceiver speed grades and electrical characteristics, and is intended for applications that need high integration, configurable logic, and flexible I/O resources.

Key Features

• High logic capacity — Approximately 490,000 logic elements suitable for complex digital functions and large-scale FPGA designs.
• Embedded memory — Approximately 42 Mbits of on‑chip RAM for buffering, LUTs, and memory‑intensive processing.
• Rich I/O — 432 user I/O pins to support wide parallel interfaces and multiple I/O standards at the board level.
• Industrial temperature grade — Specified operating range from −40 °C to 100 °C for deployment in industrial environments.
• Low-voltage core supply — Core voltage supply specified at 820 mV to 880 mV to match Stratix V power domains.
• Package and mounting — 1517‑FBGA (40×40) package in a surface‑mount form factor for compact, high‑density board designs.
• Series transceiver capability (family-level) — The Stratix V GX family datasheet documents transceiver speed grades up to 14.1 Gbps for family devices; consult series documentation for transceiver details.
• RoHS compliant — Device meets RoHS requirements for lead‑free manufacturing processes.

Typical Applications

• High‑density digital processing — Implement complex datapath logic, packet processing, and custom accelerators using extensive logic elements and embedded RAM.
• Networking and communications — Support wide I/O and family transceiver options for high‑throughput connectivity and protocol bridging.
• Instrumentation and test equipment — Use the device’s large logic and memory resources to implement signal processing, data aggregation, and real‑time analysis.

Unique Advantages

• Substantial programmable fabric — Approximately 490k logic elements enable consolidation of multiple functions onto a single FPGA, reducing system complexity.
• Significant on‑chip memory — ~42 Mbits of embedded RAM supports buffering and large LUT structures without external memory overhead.
• High I/O count — 432 I/Os provide the flexibility to interface with multiple peripherals and parallel buses directly.
• Industrial temperature support — −40 °C to 100 °C rating extends suitability to harsher operating environments.
• Compact BGA footprint — 1517‑FBGA (40×40) package offers board‑level density for space‑constrained designs.
• Compliance and manufacturing readiness — RoHS compliance simplifies integration into lead‑free production flows.

Why Choose 5SGXMB5R3F40I3LG?

The 5SGXMB5R3F40I3LG combines high logic density, substantial embedded memory, and a large I/O complement in a compact 1517‑FBGA package rated for industrial temperatures. It is positioned for engineers seeking a scalable FPGA fabric for complex signal processing, high‑throughput interfacing, and dense system integration while adhering to industry RoHS requirements.

This device is suitable for designs where consolidation of logic, memory, and I/O onto a single programmable device reduces BOM and simplifies board architecture. Refer to the Stratix V GX series documentation for additional family‑level transceiver and electrical characteristics when planning high‑speed interface implementations.

Request a quote or submit an inquiry to get pricing and availability for part number 5SGXMB5R3F40I3LG and to discuss how this FPGA can fit your next design.