5SGXMB5R3F40C4N

IC FPGA 432 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 41984000 490000 1517-FBGA (40x40)

Quantity 219 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-FBGA (40x40)Number of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits41984000

Overview of 5SGXMB5R3F40C4N – Stratix® V GX Field Programmable Gate Array (FPGA), 490,000 logic elements, 432 I/O

The 5SGXMB5R3F40C4N is a Stratix® V GX family Field Programmable Gate Array (FPGA) from Intel, packaged in a 1517‑FBGA (40×40) surface‑mount package. It delivers large programmable logic capacity and substantial on‑chip memory for designs that require high integration density and extensive I/O.

Targeted at commercial‑grade applications, this device combines approximately 490,000 logic elements with roughly 42 Mbits of embedded memory and 432 user I/O pins, offering designers a compact, high‑capacity programmable fabric with a low‑voltage core operating window.

Key Features

  • Logic Capacity  Approximately 490,000 logic elements to implement complex programmable logic, state machines, and custom datapaths.
  • Embedded Memory  Approximately 42 Mbits of on‑chip RAM for large buffers, FIFOs, and memory‑intensive functions.
  • I/O Resources  432 user I/O pins to support wide parallel interfaces, multiple peripherals, and board‑level connectivity.
  • Power and Core Voltage  Core supply range of 820 mV to 880 mV for integration into low‑voltage system domains.
  • Package & Mounting  1517‑FBGA (40×40) package in a surface‑mount form factor for compact PCB integration.
  • Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Regulatory Compliance  RoHS compliant.
  • Manufacturer  Intel Stratix V GX family architecture and supporting device documentation.

Typical Applications

  • High‑density programmable logic  Implement large custom logic blocks and complex state machines using the device’s extensive logic element pool.
  • Memory‑intensive buffering  Leverage approximately 42 Mbits of embedded RAM for packet buffering, streaming data FIFOs, and on‑chip scratchpad storage.
  • Multi‑interface bridging  Use 432 I/O pins to interface multiple parallel and serial peripherals or to aggregate wide data buses at board level.
  • Compact system integration  The 1517‑FBGA surface‑mount package supports high‑density PCB layouts where board space is constrained.

Unique Advantages

  • Large programmable fabric: The approximately 490,000 logic elements enable implementation of complex logic and large-scale integration on a single device, reducing external component count.
  • Significant on‑chip memory: Roughly 42 Mbits of embedded RAM provides on‑device storage for buffering and state, minimizing external memory reliance.
  • High I/O availability: 432 I/O pins afford flexibility for parallel data paths, multiple peripherals, and extensive board‑level interfacing.
  • Compact, industry‑standard package: 1517‑FBGA (40×40) surface‑mount package supports dense PCB layouts and automated assembly workflows.
  • Low‑voltage core compatibility: 820 mV–880 mV supply window allows integration into modern low‑voltage system domains.
  • Commercial deployment ready: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial products.

Why Choose 5SGXMB5R3F40C4N?

The 5SGXMB5R3F40C4N positions itself as a high‑capacity, commercially graded Stratix V GX FPGA suitable for designs that demand large logic arrays, significant on‑chip memory, and extensive I/O in a compact package. Its combination of approximately 490,000 logic elements, roughly 42 Mbits of embedded RAM, and 432 I/O pins makes it well suited for complex board‑level integration where consolidating functionality onto a single FPGA reduces BOM and simplifies system architecture.

Backed by Intel’s Stratix V family documentation and device specifications, this part is appropriate for engineering teams seeking a robust programmable platform for commercial applications that require scalable logic resources and dense I/O in a surface‑mount BGA footprint.

Request a quote or submit a quotation request to obtain pricing, availability, and lead‑time information for the 5SGXMB5R3F40C4N.

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