5SGXMB5R3F40I4N

IC FPGA 432 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 41984000 490000 1517-FBGA (40x40)

Quantity 1,104 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-FBGA (40x40)Number of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits41984000

Overview of 5SGXMB5R3F40I4N – Stratix® V GX FPGA IC, 1517-FBGA (40×40)

The 5SGXMB5R3F40I4N is an Intel Stratix® V GX field-programmable gate array (FPGA) supplied in a 1517-FBGA (40×40) package. It provides high-density programmable logic with 490,000 logic elements and approximately 42 Mbits of embedded RAM, plus up to 432 user I/O pins—delivering a compact, highly configurable silicon building block for demanding industrial designs.

This device targets applications requiring large on-chip logic capacity, substantial embedded memory, and broad I/O integration while operating across an industrial temperature range and low-voltage core supply.

Key Features

  • High-density logic  490,000 logic elements for complex programmable logic and large-scale FPGA designs.
  • Embedded memory  Approximately 42 Mbits of total on-chip RAM to support deep buffering, local data storage, and memory-intensive logic functions.
  • I/O and package  Up to 432 user I/O in a 1517-FBGA (40×40) surface-mount package for high pin-count system integration in a compact form factor.
  • Power  Core voltage supply range specified at 820 mV to 880 mV, enabling predictable power budgeting for FPGA core domains.
  • Industrial temperature operation  Rated for −40°C to 100°C operation to meet industrial-environment requirements.
  • Mounting and compliance  Surface-mount package with RoHS compliance for modern PCB assembly and environmental requirements.

Unique Advantages

  • Extensive programmable capacity: 490,000 logic elements enable implementation of large, complex functions and system-on-chip–style integration.
  • Substantial on-chip RAM: Approximately 42 Mbits of embedded memory reduces external memory dependency and shortens data paths for higher determinism.
  • High I/O density: 432 I/O pins provide flexibility for interfacing with multiple peripherals, sensors, and high-pin-count subsystems.
  • Industrial-grade thermal range: −40°C to 100°C rating supports deployment in industrial environments where extended temperature tolerance is required.
  • Compact BGA footprint: 1517-FBGA (40×40) balances high pin count with a space-efficient package for dense PCB layouts.
  • Standards-ready assembly: Surface-mount packaging and RoHS compliance align with modern manufacturing and regulatory expectations.

Why Choose 5SGXMB5R3F40I4N?

The 5SGXMB5R3F40I4N places a large Stratix® V GX FPGA fabric—490,000 logic elements and approximately 42 Mbits of embedded RAM—into a 1517-FBGA (40×40) surface-mount package with up to 432 I/O. Its specified core voltage window and industrial temperature rating make it suitable for designs that require robust programmable capacity, significant on-chip memory, and reliable operation across extended temperatures.

As a member of the Stratix V family, electrical and switching characteristics are documented in the device datasheet, supporting system-level power budgeting and timing analysis for complex designs. Choose this device when you need dense programmable logic and memory in a compact, industrial-grade FPGA package.

Request a quote or submit an RFQ for pricing and lead-time information to move your design forward with the 5SGXMB5R3F40I4N.

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