5SGXMB5R3F43C2LN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 41984000 490000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 893 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 41984000 |
Overview of 5SGXMB5R3F43C2LN – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 1760-FCBGA
The 5SGXMB5R3F43C2LN is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel. It delivers a high density of programmable logic elements and on-chip RAM in a 1760-ball FCBGA package suitable for surface-mount assembly.
This commercial-grade device provides 490,000 logic elements, approximately 42 Mbits of embedded memory, and up to 600 I/O pins, with a core supply voltage range of 820 mV to 880 mV and an operating temperature range of 0°C to 85°C.
Key Features
- Core Logic 490,000 logic elements (cells) for high-density programmable logic integration.
- Configurable Logic Blocks (CLBs) 185,000 LABs/CLBs reported for fine-grained logic partitioning.
- Embedded Memory Approximately 42 Mbits of total on-chip RAM (41,984,000 bits) to reduce external memory dependency.
- I/O Capacity Up to 600 general-purpose I/O pins to support broad peripheral and bus connectivity.
- Power Core supply voltage specified from 820 mV to 880 mV for device operation.
- Package 1760-FCBGA (42.5 × 42.5 mm) / 1760-BBGA package case; surface-mount form factor for dense PCB integration.
- Temperature Range Commercial operating range: 0°C to 85°C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic density: 490,000 logic elements provide capacity to consolidate large FPGA designs and reduce multi-chip solutions.
- Substantial embedded memory: Approximately 42 Mbits of on-chip RAM helps minimize external memory interfaces and simplifies board design.
- Extensive I/O count: 600 I/Os allow direct connectivity to multiple peripherals, buses, and mezzanine interfaces without excessive multiplexing.
- Compact FCBGA package: The 1760-FCBGA (42.5 × 42.5 mm) delivers high pin-density in a package suited for advanced PCB layouts.
- Commercial-grade operating range and RoHS compliance: Designed for standard commercial environments while meeting modern environmental requirements.
Why Choose 5SGXMB5R3F43C2LN?
5SGXMB5R3F43C2LN positions itself as a high-density Stratix V GX FPGA option for designs that demand large programmable logic capacity, significant on-chip RAM, and broad I/O resources in a compact FCBGA package. Its documented electrical characteristics and operating conditions are part of the Stratix V device documentation provided by the manufacturer.
This device is appropriate for customers and designs that require substantial integration of logic and memory on a commercial-grade FPGA platform, while adhering to specified supply-voltage and temperature limits documented for the device family.
Request a quote or submit an inquiry to obtain pricing, lead-time, and ordering details for 5SGXMB5R3F43C2LN.

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