5SGXMB5R3F43C2LN

IC FPGA 600 I/O 1760FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 41984000 490000 1760-BBGA, FCBGA

Quantity 893 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits41984000

Overview of 5SGXMB5R3F43C2LN – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 1760-FCBGA

The 5SGXMB5R3F43C2LN is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel. It delivers a high density of programmable logic elements and on-chip RAM in a 1760-ball FCBGA package suitable for surface-mount assembly.

This commercial-grade device provides 490,000 logic elements, approximately 42 Mbits of embedded memory, and up to 600 I/O pins, with a core supply voltage range of 820 mV to 880 mV and an operating temperature range of 0°C to 85°C.

Key Features

  • Core Logic  490,000 logic elements (cells) for high-density programmable logic integration.
  • Configurable Logic Blocks (CLBs)  185,000 LABs/CLBs reported for fine-grained logic partitioning.
  • Embedded Memory  Approximately 42 Mbits of total on-chip RAM (41,984,000 bits) to reduce external memory dependency.
  • I/O Capacity  Up to 600 general-purpose I/O pins to support broad peripheral and bus connectivity.
  • Power  Core supply voltage specified from 820 mV to 880 mV for device operation.
  • Package  1760-FCBGA (42.5 × 42.5 mm) / 1760-BBGA package case; surface-mount form factor for dense PCB integration.
  • Temperature Range  Commercial operating range: 0°C to 85°C.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • High logic density: 490,000 logic elements provide capacity to consolidate large FPGA designs and reduce multi-chip solutions.
  • Substantial embedded memory: Approximately 42 Mbits of on-chip RAM helps minimize external memory interfaces and simplifies board design.
  • Extensive I/O count: 600 I/Os allow direct connectivity to multiple peripherals, buses, and mezzanine interfaces without excessive multiplexing.
  • Compact FCBGA package: The 1760-FCBGA (42.5 × 42.5 mm) delivers high pin-density in a package suited for advanced PCB layouts.
  • Commercial-grade operating range and RoHS compliance: Designed for standard commercial environments while meeting modern environmental requirements.

Why Choose 5SGXMB5R3F43C2LN?

5SGXMB5R3F43C2LN positions itself as a high-density Stratix V GX FPGA option for designs that demand large programmable logic capacity, significant on-chip RAM, and broad I/O resources in a compact FCBGA package. Its documented electrical characteristics and operating conditions are part of the Stratix V device documentation provided by the manufacturer.

This device is appropriate for customers and designs that require substantial integration of logic and memory on a commercial-grade FPGA platform, while adhering to specified supply-voltage and temperature limits documented for the device family.

Request a quote or submit an inquiry to obtain pricing, lead-time, and ordering details for 5SGXMB5R3F43C2LN.

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