5SGXMB5R3F43C3N

The 5SGXMB5R3F43C3N is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, supplied in a 1760‑FBGA (1760‑FCBGA) package. It targets high‑density, performance‑oriented designs that require large programmable logic capacity, abundant on‑chip memory and extensive I/O.

This commercial‑grade device is suited for applications that need substantial logic resources and I/O integration while operating within standard commercial temperature and voltage ranges.

Key Features

• Core logic  Approximately 490,000 logic elements provide a high level of programmable logic resource for complex FPGA designs.
• Embedded memory  Approximately 42 Mbits of on‑chip RAM to support buffering, lookup tables and memory‑intensive functions.
• I/O capacity  600 I/O pins to enable wide external connectivity and dense board‑level interfacing.
• Power supply  Core voltage supply specified from 820 mV to 880 mV, enabling designers to plan power distribution and decoupling for the device.
• Package  1760‑BBGA, FCBGA package (supplier device package: 1760‑FCBGA, 42.5×42.5 mm) for surface‑mount PCB assembly.
• Mounting  Surface mount device suitable for standard PCB assembly processes.
• Temperature range  Commercial grade operating range from 0 °C to 85 °C for typical commercial applications.
• Standards compliance  RoHS compliant, supporting environmental and regulatory requirements for lead‑free assembly.
• Stratix V GX family characteristics  Device belongs to the Stratix V GX family; the family datasheet provides electrical and switching characteristics, operating conditions and device speed‑grade offerings.

Typical Applications

• High‑performance data processing  Large logic and memory resources enable packet processing, custom accelerators and complex dataflow implementations.
• Telecommunications and networking  Extensive I/O count supports front‑end interfaces and dense board connectivity for networking equipment.
• Prototyping and system integration  Substantial on‑chip resources and a high pin count make the device suitable for integrating multiple subsystems into a single FPGA fabric.

Unique Advantages

• High logic density: The large number of logic elements simplifies partitioning of complex designs and reduces the need for multiple devices.
• Significant embedded memory: Approximately 42 Mbits of on‑chip RAM reduces reliance on external memory for many buffering and LUT requirements.
• Broad external connectivity: 600 I/O pins enable flexible interfacing with a variety of peripherals and high‑pin count board designs.
• Commercial temperature suitability: Rated for 0 °C to 85 °C, matching the needs of mainstream commercial products and systems.
• RoHS compliance: Supports lead‑free manufacturing requirements and environmental compliance goals.
• Package for dense designs: 1760‑FCBGA package with 42.5×42.5 mm footprint supports high‑density PCB layouts and surface‑mount assembly.

Why Choose 5SGXMB5R3F43C3N?

The 5SGXMB5R3F43C3N combines substantial logic capacity, plentiful embedded memory and a high I/O count in a single commercial‑grade Stratix V GX package. It is positioned for designers who require a large, integrated FPGA fabric to consolidate functions, reduce board count and accelerate time to market.

With a defined core voltage range, a documented commercial operating temperature window and RoHS compliance, this device is appropriate for demanding commercial applications where verified electrical characteristics and packaging details are essential for system design and supply‑chain planning.

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