5SGXMB5R3F43I3G

The 5SGXMB5R3F43I3G is a Stratix V GX Field Programmable Gate Array (FPGA) IC supplied in a 1760-ball FCBGA package (42.5 × 42.5 mm). As a member of the Stratix V GX family, it delivers very high logic capacity and extensive I/O while meeting industrial temperature requirements.

Designed for demanding, high-density designs, the device combines substantial embedded memory and broad I/O for applications that require complex logic, deterministic operation across a wide temperature range, and a compact surface-mount package.

Key Features

• Logic capacity — 490,000 logic elements for implementing large-scale digital designs and complex custom logic functions.
• Logic array blocks — 185,000 logic array blocks (per product data) supporting hierarchical and block-based designs.
• Embedded memory — approximately 42 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• High I/O count — 600 general-purpose I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power and core supply — voltage supply range of 820 mV to 880 mV as specified for device operation.
• Industrial temperature grade — rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Package and mounting — 1760-ball FCBGA (1760-BBGA) surface-mount package, 42.5 × 42.5 mm footprint for high-density PCB designs.
• Series-level transceiver options — Stratix V GX family transceiver speed grades listed in the device datasheet include channel options such as 14.1 Gbps and 12.5 Gbps (series-level specification).
• Regulatory status — RoHS compliant.

Typical Applications

• High-density digital systems — Implement large custom accelerators, protocol engines, and complex control logic using the device's 490,000 logic elements and extensive embedded RAM.
• Industrial control and automation — Industrial-grade temperature rating (−40 °C to 100 °C) and robust packaging support deployment in factory-floor and process-control environments.
• Multi-port I/O bridging — 600 I/Os enable wide parallel data paths, multiple interface endpoints, and board-level protocol translation or aggregation.
• High-speed serial connectivity (series-level) — As part of the Stratix V GX family, the device aligns with transceiver speed grades described in the datasheet for high-speed serial link implementations.

Unique Advantages

• High logic density: 490,000 logic elements let you consolidate functions that would otherwise require multiple devices, reducing BOM and board area.
• Substantial on-chip memory: Approximately 42 Mbits of embedded RAM supports local buffering and stateful logic without external memory in many designs.
• Large I/O footprint: 600 I/Os provide flexibility to connect numerous peripherals, sensors, or parallel interfaces directly to the FPGA.
• Industrial temperature rating: −40 °C to 100 °C operation provides margin for deployment in challenging thermal environments.
• Compact FCBGA packaging: 1760-ball FCBGA (42.5 × 42.5 mm) delivers high pin count in a controlled form factor for dense PCB layouts.
• Standards-aware series design: The Stratix V GX family datasheet documents transceiver speed grades and electrical characteristics to support system-level planning.

Why Choose 5SGXMB5R3F43I3G?

The 5SGXMB5R3F43I3G combines very high logic density, significant embedded memory, and a large number of I/Os in an industrial-temperature, surface-mount FCBGA package. It is positioned for engineers designing complex, high-density systems that require deterministic operation across a wide temperature range and a compact board footprint.

Backed by the Stratix V family datasheet and Intel’s device documentation, this device is suitable for designs that need scalable logic resources, on-chip RAM, and a high I/O count while adhering to RoHS requirements.

If you would like pricing, availability, or technical assistance for 5SGXMB5R3F43I3G, request a quote or submit an inquiry to discuss your project requirements and lead times.