5SGXMB5R3F43C4N

IC FPGA 600 I/O 1760FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 41984000 490000 1760-BBGA, FCBGA

Quantity 296 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits41984000

Overview of 5SGXMB5R3F43C4N – Stratix® V GX FPGA, 1760-FCBGA (42.5×42.5)

The 5SGXMB5R3F43C4N is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1760-ball FCBGA package (42.5 mm × 42.5 mm). It provides a high-density programmable fabric with a large on-chip memory pool and extensive I/O for complex digital designs.

This commercial-grade device is designed for applications that require substantial programmable logic, significant embedded RAM, and a wide set of I/O. Key device attributes include approximately 490,000 logic elements, roughly 42 Mbits of embedded memory, 600 I/O pins, a core supply range of 820 mV to 880 mV, and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity  Approximately 490,000 logic elements (cells) provide the programmable fabric needed for large-scale digital designs and complex RTL integration.
  • Embedded Memory  Approximately 42 Mbits of on-chip RAM for data buffering, FIFOs, and local memory structures to support data-intensive functions.
  • High I/O Count  600 I/O pins enable broad external connectivity for high-pin-count systems and dense board-level interfaces.
  • Power and Core Supply  Core voltage supply range is specified at 820 mV to 880 mV to match system power-rail planning.
  • Package & Mounting  1760-FCBGA (1760-BBGA) package, 42.5 mm × 42.5 mm; surface-mount device suitable for high-density board designs.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for commercial-environment deployments.
  • Standards & Compliance  RoHS-compliant manufacturing status.
  • Stratix V GX Family  Part of the Stratix V GX device family; consult the device datasheet for family-level electrical and transceiver characteristics and available speed grades.

Typical Applications

  • High-density digital systems  Large programmable fabric and abundant embedded RAM make this device suitable for complex custom logic, protocol aggregation, and hardware acceleration tasks.
  • Data buffering and packet processing  Approximately 42 Mbits of on-chip RAM supports buffering and packet handling in networking and communication-oriented designs.
  • Multi-I/O interface hubs  With 600 I/O pins, the device is well suited for applications requiring many parallel interfaces or mixed I/O standards on a single device.

Unique Advantages

  • Large programmable fabric: High logic capacity enables integration of complex state machines, DSP pipelines, and control logic into a single IC, reducing external component count.
  • Substantial on-chip memory: Nearly 42 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching needs, improving system responsiveness.
  • Extensive connectivity: 600 I/O pins simplify board-level routing for multi-channel systems and dense peripheral integration.
  • Commercial-grade robustness: Specified operating temperature and RoHS compliance support reliable deployment in commercial environments.
  • Board-level packaging: 1760-FCBGA surface-mount package enables compact, high-density PCB designs while providing the pin count needed for complex systems.

Why Choose 5SGXMB5R3F43C4N?

The 5SGXMB5R3F43C4N positions itself as a high-capacity, commercial-grade Stratix V GX FPGA option for designers who need large programmable logic resources, significant embedded memory, and broad I/O in a single device. Its package and electrical specifications support dense, high-performance board designs where integration and on-chip resources reduce BOM complexity.

This device is suitable for engineering teams building complex digital systems that require scalability of logic and memory on a commercial temperature platform, supported by the Stratix V family documentation and device-level electrical characteristics.

Request a quote or submit a procurement inquiry to receive pricing and lead-time information for the 5SGXMB5R3F43C4N. Include part number and required quantities for a prompt response.

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