5SGXMB5R3F43C2N

The 5SGXMB5R3F43C2N is a Stratix V GX field-programmable gate array (FPGA) from Intel, provided in a 1760-FCBGA (42.5 × 42.5 mm) surface-mount package. This high-density, commercial-grade FPGA combines large logic capacity, substantial embedded memory, and an extensive I/O complement for demanding programmable-logic designs.

Designed for applications that require dense programmable logic and multiple high-speed interfaces, the device delivers a measured combination of logic resources, on-chip RAM, and I/O bandwidth while operating within a commercial temperature range and a core voltage window of 870 mV to 930 mV.

Key Features

• Core logic capacity — Approximately 490,000 logic elements, providing high-density programmable resources for complex FPGA designs.
• Embedded memory — Approximately 42 Mbits of on-chip RAM to support large buffering, packet processing, and algorithmic implementations.
• I/O resources — 600 user I/O pins to support extensive peripheral connectivity and multi-lane serial or parallel interfaces.
• High-speed transceiver support (Stratix V GX) — Family documentation specifies GX transceiver speed grades (examples include up to 14.1 Gbps), enabling high-bandwidth serial links where required.
• Power and supply — Core supply voltage range specified at 870 mV to 930 mV for predictable power design and board-level integration.
• Package and mounting — 1760-FCBGA package (42.5 × 42.5 mm), surface-mount mounting type for compact PCB integration.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation to match mainstream commercial applications.
• Regulatory status — RoHS compliant.

Typical Applications

• High-speed serial interfaces — Leverage Stratix V GX transceiver capability for multi-gigabit serial links and backplane connectivity.
• Network and data-path processing — Use the device’s large logic element count and on-chip RAM for packet processing, buffering, and protocol acceleration.
• Compute and algorithm acceleration — Implement custom datapaths and parallel processing engines using the extensive logic and memory resources.
• Multi‑I/O systems — Support complex mixed-signal front-ends or dense peripheral arrays with 600 available I/O pins.

Unique Advantages

• High-density programmable fabric: Approximately 490k logic elements enable integration of large functions and system consolidation on a single device.
• Substantial embedded memory: ~42 Mbits of on-chip RAM reduces external memory dependency for buffering and intermediate data storage.
• Extensive I/O count: 600 I/O pins give designers flexibility to connect multiple interfaces and expand functionality without additional devices.
• High-speed serial capability: Stratix V GX transceiver speed grades (documented in the device family datasheet) support demanding serial link requirements.
• Compact, manufacturable package: 1760-FCBGA (42.5 × 42.5 mm) surface-mount package balances density and board-level integration for production environments.
• Commercial-grade operating range: Rated for 0 °C to 85 °C operation with documented electrical characteristics for reliable commercial deployments.

Why Choose 5SGXMB5R3F43C2N?

The 5SGXMB5R3F43C2N provides a high-density, commercially graded Stratix V GX FPGA option that brings together nearly half a million logic elements, roughly 42 Mbits of embedded RAM, and 600 I/Os in a 1760-FCBGA package. Its documented transceiver speed grades and electrical characteristics enable designers to implement complex, high-throughput systems within a clearly defined power and thermal envelope.

This device is suited for teams building programmable systems that require significant on-chip resources and multi‑lane connectivity while remaining within commercial temperature and supply constraints. Backed by the Stratix V family documentation, it supports engineered, scalable designs that rely on detailed electrical and timing specifications.

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