5SGXMB5R3F43C2LG

The 5SGXMB5R3F43C2LG is an Intel Stratix V GX field programmable gate array supplied in a 1760-FCBGA (42.5 × 42.5 mm) surface-mount package. It delivers a high density of programmable logic with 490,000 logic elements and approximately 42 Mbits of embedded RAM, combined with up to 600 general-purpose I/Os for complex, high-pin-count designs.

Designed for commercial-temperature applications (0 °C to 85 °C) and RoHS compliant, this device targets designs that require substantial logic capacity, on-chip memory, and extensive I/O connectivity while operating on a low core-voltage supply of 820 mV to 880 mV.

Key Features

• Core Logic 
  490,000 logic elements provide substantial programmable resources for complex digital functions and logic consolidation.
• Embedded Memory 
  Approximately 42 Mbits of on-chip RAM to support buffering, state machines, and memory-intensive logic without relying on external memory.
• I/O Capacity 
  Up to 600 I/O pins enable dense connectivity for peripherals, interfaces, and multi-lane systems.
• Package & Mounting 
  1760-FCBGA (42.5 × 42.5 mm) package in a surface-mount form factor for compact board-level integration.
• Power 
  Core supply operating range of 820 mV to 880 mV for low-voltage core designs.
• Temperature Grade 
  Commercial grade specified for 0 °C to 85 °C operation.
• Environmental Compliance 
  RoHS compliant to meet standard environmental requirements.

Typical Applications

• High-density logic processing 
  Implement large-scale combinational and sequential logic using 490,000 logic elements for complex algorithm acceleration and custom datapaths.
• Memory-intensive functions 
  Use approximately 42 Mbits of embedded RAM for buffering, FIFOs, and on-chip storage to reduce external memory dependence.
• I/O-rich systems 
  Support extensive peripheral and subsystem interfacing with up to 600 I/Os for multi-channel and multi-protocol designs.
• Compact, board-level integration 
  The 1760-FCBGA surface-mount package (42.5 × 42.5 mm) enables high-density PCB layouts where board space is constrained.

Unique Advantages

• Highly integrated logic and memory: 490,000 logic elements combined with ~42 Mbits of embedded RAM reduce the need for external components and simplify system architecture.
• Extensive connectivity: 600 I/Os provide flexibility to interface with numerous peripherals, sensors, and external subsystems without additional multiplexing hardware.
• Compact FCBGA package: 1760-FCBGA (42.5 × 42.5 mm) supports dense PCB designs while maintaining a surface-mount assembly process.
• Low-voltage core operation: Core supply range of 820 mV to 880 mV aligns with low-voltage FPGA design approaches to optimize power delivery networks.
• Commercial-temperature readiness: Specified 0 °C to 85 °C operation for a broad range of commercial applications.
• Regulatory compliance: RoHS compliance supports environmental and regulatory requirements for product deployment.

Why Choose 5SGXMB5R3F43C2LG?

The 5SGXMB5R3F43C2LG provides a compelling combination of high logic capacity, substantial on-chip memory, and a large I/O count in a compact 1760-FCBGA surface-mount package. Its commercial temperature rating and RoHS compliance make it suitable for a wide range of commercial electronic systems that need significant programmable resources and dense board integration.

This device is well suited for engineering teams and procurement focused on consolidating complex functions onto a single FPGA, reducing BOM complexity, and achieving flexible I/O-driven designs while operating within a low-voltage core environment.

Request a quote or submit an inquiry to receive pricing, lead-time, and availability information for the 5SGXMB5R3F43C2LG.