5SGXMB5R3F43C4G

The 5SGXMB5R3F43C4G is a Stratix® V GX field-programmable gate array (FPGA) in a 1760-ball FCBGA package. It delivers a very large logic fabric with integrated on-chip memory and a high I/O count for complex, board-level programmable logic designs.

Targeted at commercial temperature applications, this device combines 490,000 logic elements and approximately 42 Mbits of embedded memory with the I/O capacity and power characteristics expected for advanced Stratix V GX devices.

Key Features

• Core Logic  Approximately 490,000 logic elements for large-scale programmable logic and complex system integration.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM to support deep buffering, large FIFOs, and data-centric architectures.
• I/O Capacity  600 user I/Os to accommodate wide parallel interfaces and extensive board-level connectivity.
• Power Supply  Core voltage supply specified from 820 mV to 880 mV to match Stratix V GX core operating requirements.
• Package and Mounting  1760-FCBGA (42.5×42.5 mm) surface-mount package for high-density board designs and robust thermal/mechanical mounting.
• Temperature Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards and Compliance  RoHS compliant.
• Series Transceiver Options  Stratix V GX family transceiver speed grades are documented in the device series datasheet (series includes GX channel grades up to 14.1 Gbps), useful when designing high-speed serial links.

Typical Applications

• High-density programmable logic  Large-scale FPGA implementations and system integration where extensive logic and embedded memory are required.
• High I/O systems  Board-level designs that need hundreds of I/Os for parallel interfaces, large peripheral sets, or multi-lane connectivity.
• High-speed serial link designs  Applications referencing Stratix V GX transceiver grades for serial communications and protocol bridging.
• Prototyping and evaluation platforms  Complex SoC and accelerator prototyping that benefit from a high logic count and substantial on-chip memory.

Unique Advantages

• High logic capacity: 490,000 logic elements enable implementation of large, integrated FPGA systems without immediate partitioning across multiple devices.
• Substantial embedded memory: Approximately 42 Mbits of on-chip RAM reduce external memory dependence and simplify board routing for data-heavy designs.
• Extensive I/O: 600 I/Os support broad connectivity options for complex peripheral integration and multi-channel interfaces.
• Compact FCBGA package: 1760-ball FCBGA (42.5×42.5 mm) provides a dense package for high-performance boards while maintaining surface-mount assembly compatibility.
• Commercial temperature rating: Specified operating range of 0 °C to 85 °C for standard commercial deployments.
• Standards alignment: RoHS compliance supports regulatory and supply-chain requirements for commercial products.

Why Choose 5SGXMB5R3F43C4G?

The 5SGXMB5R3F43C4G positions itself as a high-capacity Stratix V GX FPGA option for designers needing a large logic fabric, significant embedded memory, and a high number of I/Os in a single commercial-grade FCBGA package. It is suitable for complex programmable designs that require on-chip resources to reduce external components and simplify board-level integration.

Supported by the Stratix V device documentation, this device is appropriate for teams focused on advanced FPGA-based systems who require clear electrical and operating specifications—including core voltage and temperature range—to plan power and thermal design precisely.

Request a quote or submit an inquiry for 5SGXMB5R3F43C4G to begin evaluating this Stratix V GX device for your next design.