5SGXMB5R2F43C3G

The 5SGXMB5R2F43C3G is a Stratix V GX family Field Programmable Gate Array (FPGA) in a 1760-FCBGA package, designed for high-density programmable logic and substantial on-chip memory integration. With a large logic capacity and extensive I/O, this commercial-grade device addresses designs that require significant gate count, embedded memory, and dense external connectivity.

Key Features

• Core Logic  Approximately 490,000 logic elements provide a high-capacity fabric for complex digital designs and wide parallelism.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM supports large buffering, lookup tables, and memory-intensive functions without immediate external memory dependence.
• I/O Density  600 device I/Os enable dense connectivity to peripherals, memory, and multi-lane interfaces directly from the FPGA package.
• Package & Mounting  1760-FCBGA (42.5 × 42.5 mm) surface-mount package delivers high pin count in a compact ball-grid array footprint for system-level routing and thermal considerations.
• Power Supply  Core voltage supply range of 820 mV to 880 mV supports defined low-voltage operation for the device core.
• Operating Grade & Temperature  Commercial grade device rated for 0 °C to 85 °C operation for standard commercial-environment deployments.
• RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• High-density logic implementations  Use the large logic element count for complex state machines, datapath processing, or massively parallel logic functions.
• On-chip buffering and memory-accelerated tasks  Embedded memory facilitates packet buffering, LUT storage, and intermediate data staging without immediate external RAM.
• Dense I/O and interface aggregation  600 I/Os support multi-channel interfaces and dense board-level connectivity for data aggregation and interface bridging.

Unique Advantages

• High logic capacity: Approximately 490,000 logic elements enable implementation of large-scale FPGA designs on a single device.
• Significant embedded memory: Approximately 42 Mbits of on-chip RAM reduces reliance on external memory for many buffering and lookup needs.
• Extensive I/O: 600 I/Os provide flexibility for multi-interface systems and dense peripheral connections.
• Compact, high-pin-count package: 1760-FCBGA (42.5 × 42.5 mm) balances pin density and board-area efficiency for complex system designs.
• Defined low-voltage core supply: The 820 mV–880 mV core voltage range supports predictable power-rail design and system-level power planning.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation suitable for standard commercial environments.

Why Choose 5SGXMB5R2F43C3G?

The 5SGXMB5R2F43C3G delivers a balanced combination of high logic capacity, substantial embedded memory, and extensive I/O in a single-package Stratix V GX FPGA. It is well suited for designers who require large programmable fabrics and significant on-chip RAM while keeping system routing and footprint considerations in mind.

As a commercial-grade, RoHS-compliant device with a defined core voltage range and a high-density FCBGA package, it offers a clear option for complex digital designs that prioritize integration and scalable logic resources.

Request a quote or submit an inquiry to check pricing and availability for the 5SGXMB5R2F43C3G and discuss how it fits your next design.