5SGXMB5R2F43C2LN

The 5SGXMB5R2F43C2LN is a Stratix V GX field-programmable gate array (FPGA) IC from Intel, offered in a 1760-ball FCBGA package (42.5 × 42.5 mm). This high-density, commercially graded device delivers a combination of large programmable logic capacity, substantial on-chip memory, and a high I/O count for complex, I/O‑intensive designs.

As a Stratix V GX family device, the product is defined in the Stratix V device datasheet and includes architecture elements and transceiver characteristics described for the GX family.

Key Features

• Logic Capacity — Approximately 490,000 logic elements (cells) to implement large-scale programmable logic and custom datapaths.
• Logic Resources — Approximately 185,000 logic blocks reported for mapped resource planning and floorplanning.
• Embedded Memory — Approximately 41.984 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O — 600 user I/O pins to support extensive external interfacing and board-level connectivity.
• Transceiver Family (Stratix V GX) — The Stratix V GX family includes transceiver capabilities and related I/O timing features as documented in the device datasheet.
• Core Voltage — Supply range: 820 mV to 880 mV, enabling defined power-rail design and sequencing.
• Package — 1760-FCBGA (42.5 × 42.5 mm) package case (1760-BBGA, FCBGA) for high-pin-count board layouts.
• Temperature Grade — Commercial grade operation from 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• High-density logic designs: Use the device’s approximately 490,000 logic elements to implement complex state machines, packet-processing engines, or wide datapaths.
• Memory-intensive functions: Leverage roughly 42 Mbits of embedded RAM for buffering, line-rate FIFOs, and local scratch storage.
• I/O-heavy systems: Deploy the 600 I/O pins to connect multiple external devices, parallel interfaces, and board-level peripherals.

Unique Advantages

• Substantial programmable capacity: Large logic-element count enables consolidation of multiple functions into a single FPGA, reducing system-level component count.
• Significant on-chip memory: Approximately 41.984 Mbits of embedded RAM simplifies data staging and reduces dependency on external memory for many workloads.
• High I/O density: 600 I/O pins give designers flexibility for complex interfacing and multi-channel connectivity without additional bridging logic.
• Compact high-pin-count package: 1760-FCBGA (42.5 × 42.5 mm) provides a dense footprint suitable for board-level high-pin-count routing.
• Commercial-grade operating range: Rated for 0 °C to 85 °C, matching typical commercial deployment environments.
• Standards-compliant supply range: Defined core supply window (820 mV–880 mV) supports predictable power design and sequencing.

Why Choose 5SGXMB5R2F43C2LN?

The 5SGXMB5R2F43C2LN combines high logic capacity, sizable on-chip RAM, and a large I/O complement in a single commercially graded Stratix V GX FPGA package. It is suited to designs that require dense programmable logic, significant embedded memory, and broad board-level connectivity while operating within a defined commercial temperature and voltage envelope.

As a Stratix V GX family device documented in the device datasheet, it benefits from the architecture and transceiver characteristics defined for the family, enabling designers to plan around the device’s verified electrical and timing parameters.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGXMB5R2F43C2LN.