A3P060-FGG144

The A3P060-FGG144 is a ProASIC3 Field Programmable Gate Array (FPGA) IC designed for commercial applications. It integrates 1,536 logic elements (cells), approximately 18,432 bits of on-chip RAM, and 96 general-purpose I/O in a 144-LBGA surface-mount package, providing a compact, verified programmable logic resource for embedded designs.

With a specified supply voltage range of 1.425 V to 1.575 V and an operating temperature range of 0 °C to 85 °C, this device targets standard commercial environments where a balance of logic capacity, I/O count, and board-level density is required.

Key Features

• Core Architecture — ProASIC3 FPGA family device offering reprogrammable logic suitable for a variety of embedded designs.
• Logic Capacity — 1,536 logic elements (cells) and a gate count of 60,000 to implement custom digital functions and control logic.
• Embedded Memory — 18,432 bits of on-chip RAM to support buffering, small lookup tables, and state storage directly inside the FPGA fabric.
• I/O Count — 96 I/O pins to interface with peripherals, sensors, and system buses on the board.
• Power — Specified operating supply voltage range from 1.425 V to 1.575 V to match regulated core supply rails.
• Package & Mounting — 144-LBGA package (supplier device package: 144-FPBGA 13×13) in a surface-mount form factor for compact PCB integration.
• Temperature & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant to support lead-free manufacturing processes.

Unique Advantages

• Right-sized logic density: 1,536 logic elements and 60,000 gates provide a balance between capability and cost for mid-level programmable logic needs.
• On-chip memory for compact designs: 18,432 bits of embedded RAM reduce the need for external memory for smaller buffering and LUT requirements.
• Generous I/O count: Ninety-six I/O pins allow direct connection to a range of peripherals without immediate reliance on additional I/O expanders.
• Compact LBGA package: 144-LBGA (13×13) surface-mount package delivers a small PCB footprint while supporting solderable board assembly.
• Commercial operating range: 0 °C to 85 °C rating aligns with standard commercial deployments and system-level thermal designs.
• Regulatory readiness: RoHS compliance simplifies integration into lead-free production flows.

Why Choose A3P060-FGG144?

The A3P060-FGG144 combines a stable logic element count, on-chip RAM, and a high I/O density in a compact 144-LBGA package to meet the needs of commercial embedded designs that require programmable logic without large board area or external memory commitments. Its defined voltage supply range and commercial temperature rating make it suitable for mainstream electronic products and development platforms.

This device is appropriate for engineers and procurement teams seeking a ProASIC3 FPGA option that balances integration, verified specifications, and RoHS compliance for volume manufacturing and product development cycles.

Request a quote or submit an inquiry to purchase the A3P060-FGG144 for evaluation and production planning. Our team can provide pricing, availability, and order support for this ProASIC3 FPGA device.