A3P060-TQ144I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 91 18432 144-LQFP |
|---|---|
| Quantity | 1,008 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 91 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1536 | Number of Logic Elements/Cells | 1536 | ||
| Number of Gates | 60000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of A3P060-TQ144I – ProASIC3 Field Programmable Gate Array (FPGA) IC, 91 I/O, 18,432-bit RAM, 144-LQFP
The A3P060-TQ144I is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology designed for configurable digital logic in industrial applications. It provides 1,536 logic elements, approximately 18,432 bits of on-chip RAM, and 91 general-purpose I/Os in a 144-LQFP surface-mount package.
With a low-voltage core supply range (1.425 V to 1.575 V) and an industrial operating temperature range (−40 °C to 100 °C), this FPGA is suited for designs that require deterministic, reconfigurable logic with compact packaging and RoHS compliance.
Key Features
- Core Logic 1,536 logic elements (LEs) delivering up to 60,000 gates of user-configurable logic capacity for implementing custom digital functions.
- Embedded Memory 18,432 bits of total on-chip RAM to support buffering, small lookup tables, and state storage within the FPGA fabric.
- I/O Density 91 general-purpose I/O pins suitable for direct interfacing to peripheral devices, sensors, and control signals.
- Power Core supply voltage range of 1.425 V to 1.575 V to match low-voltage system requirements.
- Package & Mounting 144-LQFP (supplier package: 144-TQFP, 20 × 20) in a surface-mount form factor for high-density PCB assembly.
- Environmental & Reliability Industrial-grade operating temperature from −40 °C to 100 °C and RoHS compliance for regulatory alignment.
Typical Applications
- Industrial Automation Implement custom control logic and I/O aggregation where industrial temperature support and reconfigurability are required.
- Embedded Control Systems Integrate glue logic, timing control, and peripheral interfaces using the device’s logic elements and 91 I/Os.
- Signal Processing and Glue Logic Use on-chip RAM and configurable gates to implement small buffers, protocol converters, and custom signal paths in compact designs.
Unique Advantages
- Compact, reconfigurable logic: 1,536 logic elements and 60,000 gates provide a flexible platform for implementing a wide range of custom digital functions.
- On-chip memory for local buffering: 18,432 bits of embedded RAM reduce the need for external memory for small-data storage and state machines.
- Substantial I/O count: 91 I/O pins enable direct interfacing to multiple peripherals and sensors without extensive external glue logic.
- Industrial temperature capability: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments.
- Industry-standard packaging: 144-LQFP surface-mount package simplifies PCB layout and assembly for compact systems.
- Regulatory compliance: RoHS-compliant construction supports environmental and manufacturing requirements.
Why Choose A3P060-TQ144I?
The A3P060-TQ144I positions itself as a practical, industrial-grade FPGA choice for engineers needing a balance of logic capacity, embedded memory, and a high I/O count in a compact 144-LQFP package. Its low-voltage core and extended temperature range make it suitable for long-term deployment in industrial and embedded control applications.
Designed by Microchip Technology as part of the ProASIC3 family, this device is appropriate for teams looking to implement custom digital functions, protocol bridging, or localized buffering while keeping board-level complexity and component count down.
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