A3P060-FGG144T

The A3P060-FGG144T is a Microchip ProASIC3 field programmable gate array (FPGA) in a 144‑ball LBGA package. It integrates 1,536 logic elements, 18,432 bits of on‑chip RAM and 96 programmable I/O, delivering a compact, qualified programmable-logic solution for embedded and automotive electronic designs.

Designed for surface‑mount applications, this device supports a 1.425 V to 1.575 V supply range and is AEC‑Q100 qualified with an operating temperature range of −40 °C to 125 °C, aligning it with automotive and other harsh‑environment system requirements.

Key Features

• Core Logic 1,536 logic elements (LEs) provide the programmable logic capacity for implementing custom digital functions and control logic.
• On‑Chip Memory 18,432 bits of total embedded RAM to support buffering, small FIFOs and state storage within the FPGA fabric.
• I/O 96 programmable I/O pins to interface with sensors, actuators, processors and peripherals in compact designs.
• Device Density Approximately 60,000 equivalent gates, enabling integration of moderate-complexity logic into a single component.
• Power Supply Operates from a 1.425 V to 1.575 V supply, allowing integration into systems with tightly defined core-voltage rails.
• Package & Mounting 144‑LBGA (supplier package 144‑FPBGA, 13 × 13 mm) in a surface‑mount form factor for space‑efficient PCB layouts.
• Automotive Qualification & Temperature Range AEC‑Q100 qualification with an operating range of −40 °C to 125 °C, supporting deployment in temperature‑challenging environments.
• Regulatory Compliance RoHS‑compliant to meet environmental and material‑composition requirements.

Typical Applications

• Automotive Electronics — Suitable for in‑vehicle control and interfacing tasks that require AEC‑Q100 qualification and wide operating temperature range.
• Embedded Control Systems — Implement control logic, custom state machines and timing-critical functions using the device’s 1,536 logic elements and on‑chip RAM.
• Sensor and Actuator Interfaces — Use the 96 I/O pins to connect multiple sensors and actuators while consolidating glue logic into a single FPGA.
• Prototyping and Low‑to‑Medium Density Integration — Integrate custom peripheral logic and small buffering requirements without adding external components.

Unique Advantages

• AEC‑Q100 Qualification: Provides the documented qualification required for automotive deployment and other high‑reliability applications.
• Wide Operating Temperature: Rated from −40 °C to 125 °C, enabling use in harsh thermal environments.
• Compact, Surface‑Mount Package: 144‑LBGA (13 × 13 mm) supports high‑density PCB designs while maintaining a small footprint.
• Balanced Logic and I/O Capacity: 1,536 logic elements paired with 96 I/Os enable consolidation of control and interface functions to reduce BOM and board complexity.
• Controlled Core Voltage: Narrow supply range (1.425 V–1.575 V) facilitates predictable power integration with systems using defined core rails.
• RoHS Compliant: Meets environmental material standards for regulatory and manufacturing requirements.

Why Choose A3P060-FGG144T?

The A3P060-FGG144T positions itself as a reliable, qualified ProASIC3 FPGA option for designs that require moderate logic density, meaningful on‑chip RAM, and a robust I/O complement in a compact LBGA package. Its AEC‑Q100 qualification and −40 °C to 125 °C operating range make it appropriate for automotive and other demanding embedded environments where temperature and qualification matter.

This device is well suited to engineers seeking to consolidate discrete logic and buffering into a single, RoHS‑compliant component while maintaining predictable power and packaging characteristics. The combination of 1,536 logic elements, 18,432 bits of embedded RAM and 96 I/Os delivers a practical balance of integration, reliability and form factor for production systems.

Request a quote or submit an inquiry to learn about availability, pricing and integration support for the A3P060-FGG144T. Our team can provide technical details and assistance to help evaluate the device for your design.