A3P060-FGG144I

The A3P060-FGG144I is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology, offering a balanced mix of logic density, I/O capability, and on-chip memory for embedded and industrial designs. It provides 1,536 logic elements, approximately 18.4 kbits of embedded RAM, and 96 general-purpose I/Os in a compact 144-LBGA package.

Designed for industrial operating conditions, this device supports a core supply range of 1.425 V to 1.575 V and operates across –40 °C to 100 °C, making it suitable for applications that require moderate gate capacity, predictable I/O counts, and robust temperature performance.

Key Features

• Core Logic 1,536 logic elements providing roughly 60,000 gates of programmable logic capacity for implementing custom digital functions.
• Embedded Memory 18,432 bits of on-chip RAM to support small data buffers, state machines, and temporary storage without external memory.
• I/O Count 96 general-purpose I/Os to interface with peripherals, sensors, and system buses.
• Power Supply Operates from a core voltage supply range of 1.425 V to 1.575 V for consistent logic performance.
• Package and Mounting 144-LBGA package (supplier device package: 144-FPBGA, 13 × 13 mm) with surface-mount mounting type for compact board integration.
• Industrial Temperature Grade Rated for an operating temperature range of –40 °C to 100 °C to meet industrial environment requirements.
• Compliance RoHS compliant to support environmentally conscious designs.

Typical Applications

• Industrial Control — Implement custom control logic, state machines, and interface glue logic for factory automation and process control equipment using the device’s 1,536 logic elements and 96 I/Os.
• Embedded Systems — Integrate protocol handling, peripheral aggregation, and small on-chip buffers without external memory, leveraging the 18,432 bits of embedded RAM.
• Communications and Interface Bridging — Provide I/O expansion and custom protocol conversion for communication modules and instrumentation with a compact 144-LBGA footprint.

Unique Advantages

• Right-sized logic capacity: 1,536 logic elements (≈60,000 gates) deliver moderate programmable logic for many embedded and industrial tasks without excessive area or power overhead.
• Integrated on-chip memory: 18,432 bits of RAM reduce the need for external memory in applications that require small buffers or local state storage.
• Generous I/O availability: 96 I/Os enable flexible connectivity to peripherals, sensors, and system buses, simplifying board-level design.
• Industrial temperature rating: –40 °C to 100 °C operation supports deployment in temperature-challenging environments.
• Compact, surface-mount package: 144-LBGA (144-FPBGA, 13×13 mm) allows for space-efficient PCB layouts in constrained designs.
• Regulatory compliance: RoHS compliance helps meet environmental and manufacturing requirements.

Why Choose A3P060-FGG144I?

The A3P060-FGG144I positions itself as a practical FPGA choice for designers needing a balance of logic density, I/O flexibility, and industrial-grade temperature performance. Its combination of 1,536 logic elements, on-chip memory, and 96 I/Os in a compact 144-LBGA package makes it well suited to embedded, control, and interface applications where a moderate programmable resource set is required.

Backed by Microchip Technology, this ProASIC3 device is intended for teams seeking predictable electrical characteristics (1.425–1.575 V core supply) and environmental compliance (RoHS) for long-term deployments in industrial settings.

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