A3P250-VQG100T

The A3P250-VQG100T is a ProASIC3 flash-based FPGA from Microchip Technology offering a mid-density logic fabric suited for designs that require on-chip memory, a moderate I/O count, and automotive-grade qualification. With 6,144 logic elements, 36,864 bits of embedded RAM and approximately 250,000 gates, it targets applications where integration, reliability and operation across a wide temperature range are important.

Qualified to AEC-Q100 and rated for operation from -40 °C to 125 °C, this surface-mount 100-TQFP packaged device provides a compact, qualified solution for systems requiring a narrow core supply voltage and robust environmental performance.

Key Features

• Core Logic  6,144 logic elements delivering approximately 250,000 gates for mid-density FPGA implementations.
• Embedded Memory  36,864 bits of on-chip RAM for data buffering, small FIFOs and state storage.
• I/O  68 general-purpose I/O pins to interface with peripherals and external devices.
• Power  Core supply voltage range of 1.425 V to 1.575 V to match low-voltage system designs.
• Package & Mounting  100-TQFP (supplier device package listed as 100‑VQFP 14×14) in a surface-mount form factor for compact PCB layouts.
• Reliability & Qualification  Automotive grade with AEC-Q100 qualification and an operating temperature range of -40 °C to 125 °C for demanding environments.
• Environmental Compliance  RoHS-compliant construction for regulatory and environmental requirements.

Typical Applications

• Automotive electronic control  AEC-Q100-qualified device suitable for vehicle applications that require robust temperature operation and component qualification.
• Temperature-challenged systems  Designs requiring reliable operation from -40 °C to 125 °C can leverage the device’s wide operating range.
• Embedded mid-density logic designs  Systems that need a balance of logic capacity, on-chip RAM and multiple GPIOs can use this FPGA to integrate functions into a single package.
• Space-constrained PCB implementations  The 100-TQFP surface-mount package supports compact board layouts while providing 68 I/O pins for peripheral connectivity.

Unique Advantages

• Automotive qualification: AEC-Q100 qualification and an automotive grade designation help simplify selection for vehicle electronics and other qualified programs.
• Balanced mid-density integration: 6,144 logic elements with 36,864 bits of on-chip RAM and ~250,000 gates provide a balanced resource set for logic, control and buffering tasks.
• Robust thermal performance: Rated for -40 °C to 125 °C to support designs exposed to wide or elevated temperature ranges.
• Narrow core voltage: A defined supply range of 1.425 V to 1.575 V supports integration with low-voltage power architectures.
• Compact, surface-mount package: 100-TQFP footprint enables denser PCB designs while offering ample I/O for system interfacing.
• Regulatory compliance: RoHS compliance addresses environmental and manufacturing requirements.

Why Choose A3P250-VQG100T?

The A3P250-VQG100T delivers a mid-density FPGA option that combines 6,144 logic elements, on-chip RAM and 68 I/O in a compact 100-TQFP surface-mount package. Its AEC-Q100 qualification and -40 °C to 125 °C rating make it appropriate for applications that require both functional integration and component qualification for demanding temperature environments.

Manufactured by Microchip Technology, this ProASIC3 device is suited for designers seeking a qualified, compact FPGA with a clear set of resources for mid-complexity control, interfacing and buffering tasks in automotive and temperature-sensitive designs.

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