A3P400-1FG256

The A3P400-1FG256 is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology designed for commercial embedded logic applications. It provides a balanced combination of logic capacity, on-chip memory, and I/O count in a compact 256-LBGA package for surface-mount assembly.

With 9,216 logic elements and approximately 0.055 Mbits of embedded memory, this device suits designs that require moderate gate density, a dense I/O set, and a single-supply core voltage in the 1.425 V–1.575 V range.

Key Features

• Logic Capacity  9,216 logic elements (cells) delivering approximately 400,000 gates for implementing custom combinational and sequential logic.
• Embedded Memory  Approximately 0.055 Mbits of on-chip RAM (55,296 bits) for small data buffers, FIFOs, and state storage.
• I/O Count  178 user I/O pins to support multiple interfaces and parallel connections without external multiplexers.
• Power and Voltage  Core supply voltage range of 1.425 V to 1.575 V for defined power sequencing and system-level power planning.
• Package and Mounting  256-LBGA package (supplier device package: 256-FPBGA, 17×17) optimized for surface-mount PCB assembly and compact board layouts.
• Operating Temperature  Commercial temperature range from 0 °C to 85 °C suitable for typical indoor and controlled-environment applications.
• Environmental Compliance  RoHS compliant, meeting common lead-free manufacturing requirements.

Typical Applications

• Commercial Embedded Systems  Implements custom control logic and data-path functions in consumer and commercial products that operate within a 0 °C–85 °C range.
• Interface Bridging and Glue Logic  Provides dense I/O and flexible logic resources for protocol conversion, bus interfacing, and signal routing tasks.
• Prototyping and Evaluation  Suitable for development platforms and proof-of-concept designs that require moderate logic density and sizable I/O counts.
• Instrumentation and Measurement  Enables custom timing, data aggregation, and preprocessing in test equipment and measurement systems.

Unique Advantages

• Compact, high-density package: 256-LBGA (256-FPBGA, 17×17) allows high pin-count and logic capacity in a small board footprint to reduce PCB area.
• Balanced logic and memory: 9,216 logic elements paired with approximately 55,296 bits of RAM supports a wide variety of control and data-path functions without immediate need for external memory.
• Generous I/O availability: 178 user I/Os simplify system design by reducing the need for external multiplexing or I/O expanders.
• Defined commercial operating range: 0 °C to 85 °C specification aligns with standard commercial product deployments and indoor environments.
• Manufacturing-friendly mounting: Surface-mount 256-LBGA package supports standard SMT assembly processes and compact board layouts.
• Regulatory-aligned materials: RoHS compliance helps meet common environmental and manufacturing requirements.

Why Choose A3P400-1FG256?

The A3P400-1FG256 is positioned as a practical, mid-density FPGA option for commercial embedded designs that require a balanced mix of logic, on-chip memory, and I/O in a compact package. Its 9,216 logic elements, roughly 55,296 bits of RAM, and 178 I/Os make it well suited to applications that need substantial interfacing and custom logic without large external memory subsystems.

Designed and supplied by Microchip Technology, this device is a suitable choice for engineers building commercial products where predictable electrical characteristics (1.425 V–1.575 V core supply) and standard temperature operation are priorities. It offers a straightforward path to integrate programmable logic into consumer and commercial systems while keeping board area and component count under control.

Request a quote or submit an inquiry to obtain pricing and availability for the A3P400-1FG256.