A3P400-1FGG144

The A3P400-1FGG144 is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology that provides a balanced combination of logic, I/O and on-chip memory in a compact ball grid array package. With 9,216 logic elements, approximately 55.3 Kbits of embedded RAM and 97 general-purpose I/O pins, it is suited to designs that require moderate logic density and dedicated I/O capacity within a 144-LBGA footprint.

Designed for commercial-grade applications, the device operates from a nominal 1.5 V supply range and supports an operating temperature range of 0 °C to 85 °C, making it appropriate for a wide range of mainstream electronic products.

Key Features

• Core Logic  9,216 logic elements (LEs) provide the programmable fabric for implementing custom combinational and sequential logic functions.
• Gate Capacity  400,000 gates to accommodate moderate-complexity logic designs.
• Embedded Memory  Total on-chip RAM of 55,296 bits (approximately 55.3 Kbits) for buffering, small data tables or state storage.
• Programmable I/O  97 I/O pins to support multiple peripheral connections and board-level interfacing.
• Power  Voltage supply range of 1.425 V to 1.575 V for core operation.
• Package and Mounting  144-LBGA package (supplier device package: 144-FPBGA, 13×13) with surface-mount mounting type for compact PCB integration.
• Operating Range  Commercial operating temperature from 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• Consumer Electronics  Implement custom control logic and peripheral interfaces using the 9,216 logic elements and 97 I/O pins in compact device footprints.
• Communications Equipment  Use the on-chip RAM and programmable logic for protocol handling, buffering and control tasks within equipment that fits the device's logic and I/O capacity.
• Prototyping and Development  Rapidly validate hardware logic and I/O configurations for designs that map to the device’s gate count and memory resources.
• Embedded Control  Implement finite-state machines, glue logic and custom interfacing functions that benefit from moderate on-chip memory and a large set of I/O.

Unique Advantages

• Balanced Logic and I/O Density: 9,216 logic elements paired with 97 I/O pins provide a practical balance for mid-range designs, reducing the need for external glue logic.
• On-Chip Memory for Local Storage: 55,296 bits of embedded RAM support buffering and small data table storage without additional memory components.
• Compact, PCB-Friendly Package: The 144-LBGA (13×13, 144-FPBGA) package enables dense board layouts while maintaining surface-mount assembly compatibility.
• Low-Voltage Core Operation: A tight core voltage range (1.425 V to 1.575 V) supports consistent power design and predictable supply requirements.
• Commercial-Grade Reliability: Specified operating temperature range (0 °C to 85 °C) and RoHS compliance make the device suitable for mainstream product lines.

Why Choose A3P400-1FGG144?

The A3P400-1FGG144 delivers a practical combination of logic capacity, embedded memory and I/O in a compact 144-LBGA package from Microchip Technology. Its 9,216 logic elements, 400,000-gate capacity and approximately 55.3 Kbits of RAM make it a suitable choice for commercial designs that require moderate programmable logic and local data storage without a large form factor.

This device is well suited for engineers and product teams building consumer electronics, communications modules, embedded controllers and development prototypes that need predictable power characteristics and a dense pin count in a surface-mount LBGA package.

Request a quote or submit a purchase inquiry to get pricing and availability for the A3P400-1FGG144 ProASIC3 FPGA.