A3P400-1FGG144I

The A3P400-1FGG144I is a ProASIC3 family FPGA from Microchip Technology, offering mid-range programmable logic in a compact ball-grid array package. It provides 9,216 logic elements and approximately 55 kbits of embedded RAM to implement custom digital logic, state machines, and peripheral glue logic for industrial applications.

Designed for surface-mount assembly and industrial-grade operation, this device supports a wide operating temperature range and a defined low-voltage core supply, making it suitable for embedded systems that require reliable logic integration and moderate I/O capacity.

Key Features

• Core Logic – 9,216 logic elements providing a logic capacity of 400,000 gates for implementing custom digital functions and moderate-density designs.
• Embedded Memory – Total on-chip RAM of 55,296 bits (approximately 55 kbits) to support FIFOs, small buffers, and local data storage.
• I/O Count – 97 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
• Power – Core voltage supply specified from 1.425 V to 1.575 V to match low-voltage system architectures.
• Package and Mounting – 144-LBGA package (supplier package: 144-FPBGA, 13×13) for a compact board footprint; designed for surface-mount assembly.
• Temperature Grade – Industrial operating temperature range from −40 °C to 100 °C for use in harsher environments.
• Compliance – RoHS-compliant device suitable for designs requiring lead-free components.

Typical Applications

• Industrial Automation – Implement control logic, protocol bridging, and custom state machines in industrial controllers that need reliable operation across −40 °C to 100 °C.
• Embedded Systems – Integrate mid-range programmable logic and local RAM to offload tasks from microcontrollers or to implement custom interfaces.
• Signal and Protocol Interfacing – Use the device’s 97 I/O pins and programmable logic to translate, buffer, or adapt signals between subsystems.

Unique Advantages

• Mid-range logic capacity: 9,216 logic elements and 400,000 gates enable complex glue logic and moderate-density designs without external ASICs.
• On-chip RAM for local buffering: Approximately 55 kbits of embedded RAM supports FIFOs and temporary data storage, reducing the need for external memory in many use cases.
• Compact, surface-mount package: 144-LBGA (13×13) provides a small PCB footprint while retaining significant I/O and logic resources.
• Industrial temperature operation: Specified for −40 °C to 100 °C, making it appropriate for equipment exposed to wide temperature ranges.
• Low-voltage core compatibility: Core supply range of 1.425 V to 1.575 V supports integration into low-voltage system designs.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing and environmental requirements.

Why Choose A3P400-1FGG144I?

The A3P400-1FGG144I balances programmable logic capacity, embedded memory, and I/O in a compact 144-LBGA package, making it a practical choice for industrial and embedded designs that require reliable mid-range FPGA capability. Its defined power and temperature specifications simplify system-level design decisions for engineers targeting robust performance in controlled and harsh environments.

Backed by Microchip Technology, this device is suited for customers building controllers, interface bridges, and application-specific logic where a combination of logic density, on-chip memory, and industrial-grade operation provides long-term value and design stability.

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