A3P400-1PQ208I

The A3P400-1PQ208I is a ProASIC3 field programmable gate array (FPGA) designed for applications that require a balance of logic capacity, on-chip memory, and a substantial I/O count. This device provides 9,216 logic elements and approximately 400,000 gates, along with 55,296 bits of embedded RAM and 151 general-purpose I/O pins in a 208-BFQFP surface-mount package.

Specified for industrial environments, the device operates from a 1.425 V to 1.575 V supply and supports an operating temperature range of −40 °C to 100 °C. The combination of logic density, I/O availability, compact 208-PQFP (28×28) package, and RoHS compliance makes it suitable for designs where integration, thermal range, and board-level packaging are primary considerations.

Key Features

• Core and Logic Capacity 9,216 logic elements providing approximately 400,000 gates for implementing custom digital functions and glue logic.
• Embedded Memory 55,296 bits of on-chip RAM (approximately 0.055 Mbits) for small buffers, FIFOs, and state storage.
• I/O Density 151 general-purpose I/O pins to support parallel interfaces, external device control, and board-level connectivity.
• Power and Voltage Low-voltage core operation with a specified supply range of 1.425 V to 1.575 V for system-level power planning.
• Package and Mounting 208-BFQFP package (supplier package: 208-PQFP, 28×28) with surface-mount mounting type for standard PCB assembly flows.
• Temperature and Grade Industrial-grade part rated for operation from −40 °C to 100 °C to accommodate wider environmental conditions.
• Environmental Compliance RoHS compliant for regulatory conformance in lead-free assemblies.

Typical Applications

• Industrial Control — Use where industrial temperature performance and robust I/O are required for control logic and peripheral interfacing.
• I/O-Intensive Systems — Suitable for boards needing many general-purpose I/O lines for sensor arrays, data capture, or parallel interfaces.
• Embedded Logic and Glue — Implement custom glue logic, protocol adaptation, and peripheral control leveraging the device’s logic elements and on-chip RAM.
• Prototyping and Volume Designs — Deploy where a surface-mount 208-BFQFP package and industrial temperature range fit board-level manufacturing and deployment needs.

Unique Advantages

• Substantial Logic Capacity: 9,216 logic elements and ~400,000 gates enable consolidation of multiple discrete functions into a single device, reducing BOM count.
• High I/O Count: 151 I/O pins allow direct interfacing to a broad range of external devices without extensive multiplexing or additional interface chips.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployments in demanding thermal environments.
• Compact Surface-Mount Package: 208-BFQFP (28×28) provides a standard, manufacturable footprint compatible with typical PCB assembly processes.
• Controlled Low-Voltage Operation: Narrow supply range (1.425 V–1.575 V) simplifies power-supply design and margining for the core rail.
• RoHS Compliant: Meets lead-free assembly requirements for regulatory and manufacturing compliance.

Why Choose A3P400-1PQ208I?

The A3P400-1PQ208I positions itself as a pragmatic FPGA choice where a well-balanced combination of logic density, on-chip memory, and extensive I/O is required in an industrial-grade package. Its specification set supports system designs that demand moderate to high logic integration while maintaining board-level manufacturability in a 208-BFQFP surface-mount footprint.

This device is well suited for engineers and procurement teams looking for a reliable, RoHS-compliant programmable logic solution that fits into existing low-voltage power architectures and operates across a wide temperature range. The A3P400-1PQ208I offers a clear path for consolidating discrete logic functions and implementing custom digital interfaces within constrained board-space and thermal envelopes.

Request a quote or submit an inquiry for the A3P400-1PQ208I to receive pricing, availability, and lead-time information specific to your requirements.