A3P400-1PQG208I
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 151 55296 208-BFQFP |
|---|---|
| Quantity | 291 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 14 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 151 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9216 | Number of Logic Elements/Cells | 9216 | ||
| Number of Gates | 400000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of A3P400-1PQG208I – ProASIC3 FPGA IC — 9,216 logic elements, 151 I/O, 208‑BFQFP
The A3P400-1PQG208I is a ProASIC3 Field Programmable Gate Array (FPGA) IC from Microchip Technology, offering a mid-density programmable logic solution. It combines 9,216 logic elements with 151 general-purpose I/Os and approximately 0.055 Mbits of embedded RAM to support a range of industrial embedded designs.
Packaged in a 208‑BFQFP surface-mount case and rated for industrial temperatures, this device is targeted at applications that require configurable logic, multiple I/O signals, and operation across a broad temperature range.
Key Features
- Core / Logic: 9,216 logic elements providing programmable logic capacity; specified as 400,000 gates for logic implementation.
- Embedded Memory: 55,296 total RAM bits (approximately 0.055 Mbits) for local data storage and buffering within logic designs.
- I/O Capability: 151 available I/O pins to support diverse peripheral and interface requirements.
- Power: Operates from a specified voltage supply range of 1.425 V to 1.575 V to meet precise core-voltage needs.
- Package & Mounting: Supplied in a 208‑BFQFP surface-mount package (supplier device package 208‑PQFP, 28×28) for compact PCB integration.
- Temperature & Grade: Industrial-grade device with an operating temperature range of −40 °C to 100 °C for reliable field operation.
- Environmental Compliance: RoHS compliant to support regulatory and assembly requirements.
Unique Advantages
- Balanced Logic and I/O Count: 9,216 logic elements paired with 151 I/Os deliver a practical balance for control, glue-logic, and moderate-complexity programmable functions.
- Compact Surface-Mount Package: The 208‑BFQFP (28×28) package enables dense PCB placement while maintaining a large I/O count.
- Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in industrial environments with wide temperature swings.
- Precise Core Voltage Range: Tight supply range (1.425 V–1.575 V) enables predictable power planning for system designs.
- Regulatory Compliance: RoHS compliance helps simplify environmental and manufacturing requirements.
Why Choose A3P400-1PQG208I?
The A3P400-1PQG208I is positioned for engineers and procurement teams seeking a mid-density FPGA from Microchip Technology that combines a meaningful logic element count, substantial I/O capacity, and a compact 208‑pin package. Its industrial temperature rating and RoHS compliance make it suitable for embedded designs that require reliable operation across temperature extremes and adherence to environmental standards.
This device is well suited to projects that need configurable logic with measurable on-chip memory and I/O resources, while maintaining a small PCB footprint and strict supply-voltage planning. Choosing this part provides a clear specification set—logic density, memory size, I/O count, package, operating temperature, and supply voltage—that supports informed design and sourcing decisions.
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