A3P400-2FG256I

The A3P400-2FG256I is a ProASIC3 Field Programmable Gate Array (FPGA) designed for industrial embedded applications. It provides 9,216 logic elements, 400,000 gates and on-chip memory to implement custom logic, control and interfacing functions within a compact 256-LBGA package.

With 178 general-purpose I/Os, a supply voltage range of 1.425 V to 1.575 V, RoHS compliance and an operating temperature range of -40 °C to 100 °C, this device is targeted at industrial systems that require a balance of integration, configurability and temperature robustness.

Key Features

• Core Logic 9,216 logic elements enabling implementation of medium-complexity custom logic and control functions.
• Gate Capacity 400,000 gates to support a broad range of combinational and sequential logic designs.
• On-chip Memory Approximately 0.055 Mbits of embedded memory (55,296 bits) for local storage, buffering and small lookup tables.
• I/O Count 178 user I/Os for flexible connectivity to sensors, actuators, buses and peripheral devices.
• Power Core supply range of 1.425 V to 1.575 V to match system power domains and ensure predictable operation within specified limits.
• Package & Mounting 256-LBGA surface-mount package (256-FPBGA, 17 × 17) for a compact PCB footprint and high pin density.
• Temperature & Grade Industrial grade operation from -40 °C to 100 °C for deployment in temperature-stressed environments.
• Environmental Compliance RoHS compliant for adherence to common environmental requirements.

Typical Applications

• Industrial Control & Automation — Use the device’s industrial temperature range and I/O density to implement motor control logic, PLC functions or machine interfacing.
• I/O-Intensive Embedded Systems — 178 I/Os support complex sensor arrays, actuators and parallel interfaces in embedded controllers.
• Instrumentation & Test Equipment — On-chip logic and memory combine to handle data aggregation, protocol handling and real-time control tasks in lab and factory instruments.
• Communications Interfaces — Deployable as a protocol bridge or custom interface engine where flexible logic and multiple I/Os are required.

Unique Advantages

• Balanced Logic and Memory Mix: 9,216 logic elements paired with 55,296 bits of on-chip RAM provide a practical combination for mid-range logic designs requiring local buffering.
• High I/O Density: 178 I/Os reduce the need for external I/O expanders and simplify board-level routing for complex peripheral sets.
• Industrial Temperature Support: Rated for -40 °C to 100 °C operation to support deployments in harsh or uncontrolled thermal environments.
• Compact, High-Pin Package: 256-LBGA (17 × 17) delivers a small PCB footprint with extensive I/O capability, aiding compact system designs.
• Predictable Power Window: A defined core supply range (1.425 V to 1.575 V) helps streamline power-supply design and stability analysis.
• RoHS Compliant: Meets environmental compliance expectations for modern electronic products.

Why Choose A3P400-2FG256I?

The A3P400-2FG256I positions itself as a practical, industrial-grade FPGA option for designers needing a mid-range logic device with substantial I/O count and on-chip memory. Its 9,216 logic elements and 400,000-gate capacity provide enough resources for control, interfacing and protocol tasks while the 256-LBGA package keeps the PCB footprint compact.

This device is well suited to engineers building industrial automation, instrumentation or I/O-rich embedded systems who require temperature robustness, clear power requirements and RoHS compliance. It offers a straightforward path to integrate custom logic while minimizing external component count and preserving board area.

Request a quote or submit an inquiry to get pricing and availability information for the A3P400-2FG256I. Our team can provide lead time and ordering details to support your design timelines.