A3P400-2FGG256I

The A3P400-2FGG256I is a ProASIC3 field programmable gate array (FPGA) IC designed for industrial applications. It provides a balanced combination of logic capacity, I/O density and on-chip memory in a compact 256-LBGA package for surface-mount assembly.

Targeted at designs that require up to 400,000 gates, 9,216 logic elements and a broad I/O set, this device supports implementations where industrial temperature range, low-voltage power domains and RoHS compliance are required.

Key Features

• Core Logic  Approximately 9,216 logic elements (LEs) providing up to 400,000 logic gates for implementing complex digital functions.
• Embedded Memory  Approximately 0.055 Mbits of on-chip RAM (55,296 total RAM bits) to support buffering, state machines and small data structures.
• I/O Capacity  178 general-purpose I/O pins to support broad connectivity and peripheral interfacing requirements.
• Package & Mounting  256-LBGA package (supplier device package: 256-FPBGA, 17×17) optimized for surface-mount PCB assembly and compact board layouts.
• Power  Specified core supply range of 1.425 V to 1.575 V for defined low-voltage operation.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C to meet elevated environmental requirements.
• Regulatory  RoHS-compliant construction for regulatory and environmental compliance.

Typical Applications

• Industrial Control  Logic and I/O consolidation in control systems where industrial temperature range and high I/O counts are required.
• Communications Infrastructure  Interface bridging and protocol handling leveraging the device’s gate count and 178 I/Os for port and peripheral connectivity.
• Instrumentation & Test Equipment  Custom timing, data acquisition front-ends and signal conditioning control that benefit from on-chip RAM and flexible logic resources.
• Embedded Systems  Custom hardware accelerators and glue logic for embedded products that require compact packaging and surface-mount assembly.

Unique Advantages

• Balanced Logic Capacity: 9,216 logic elements and 400,000 gates provide sufficient resources for mid-sized FPGA designs without excessive footprint.
• Compact Surface-Mount Package: 256-LBGA (17×17) enables dense board integration and reduced PCB area compared with larger packages.
• High I/O Density: 178 I/Os allow integration of multiple peripherals and interfaces directly on-chip, reducing external component count.
• Industrial Temperature Range: Rated −40 °C to 100 °C to support deployment in harsh or temperature-variable environments.
• Defined Low-Voltage Operation: Core supply specified between 1.425 V and 1.575 V for controlled power-domain design and predictable power budgeting.
• RoHS Compliance: Environmentally compliant manufacturing for global regulatory alignment.

Why Choose A3P400-2FGG256I?

The A3P400-2FGG256I delivers a pragmatic balance of logic, memory and I/O in a compact industrial-grade package. Its combination of roughly 9,216 logic elements, 55,296 bits of embedded RAM and 178 I/Os makes it suitable for mid-range FPGA tasks where board space, operating temperature and RoHS compliance are important design considerations.

This device is well suited to engineering teams building industrial controllers, communication peripherals, test instrumentation or embedded systems that require a stable, specified power domain and surface-mount packaging. The A3P400-2FGG256I offers clear, verifiable specifications for integration into production designs with established environmental and electrical limits.

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